TE-7901K for semiconductors
One-liquid type × high thermal conductivity! For thermal management of high-density mounted substrates.
In the semiconductor industry, high-density packaging is advancing, and as a result, the amount of heat generated is also increasing. Heat can cause performance degradation and failure of semiconductor devices, making effective thermal management essential. The TE-7901K achieves both high thermal conductivity and excellent insulation, contributing to heat dissipation measures for high-density packaging substrates. Its one-component nature ensures excellent workability and provides stable quality. 【Usage Scenarios】 - Sealing of high-density packaged semiconductor devices - Heat dissipation measures for power devices - Insulation and heat dissipation for motors and coils 【Benefits of Implementation】 - Prolonged device lifespan - Improved product reliability - Increased manufacturing process efficiency
basic information
【Features】 - One-component heat-curing epoxy resin (no mixing required, high workability) - High thermal conductivity: 6.5 W/m·K - Flame retardant: Equivalent to UL94 V-0 (5mm thickness) - High insulation and high heat resistance (Tg 110℃) - Suitable for heat dissipation and insulation sealing applications in electronic devices 【Our Strengths】 Terada Corporation has been providing its products and materials across various industrial sectors, focusing on electronic devices and chemical products. Utilizing our expertise in resin and adhesive technology along with years of know-how in the electronics industry, we contribute to solving our customers' challenges.
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Applications/Examples of results
■Encapsulation of small motors, coils, sensors, and electronic components ■Encapsulation of power devices
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Terada Corporation has been providing its own products and materials to various industrial sectors, focusing on electronic devices and chemical products. Utilizing our long-standing expertise in resin and adhesive technology within the electronics industry, we contribute to Japan, the world, and the planet.