[For Communication Speedup] TE-7901K
One-liquid type × high thermal conductivity! For thermal management in communication devices. Supports high-speed operation.
In the telecommunications industry, with the spread of high-speed communication such as 5G, the densification and high performance of communication devices are progressing. Consequently, the amount of heat generated inside the devices is increasing, making thermal management an important issue. Without appropriate thermal measures, there is a risk of performance degradation or failure of the devices. The TE-7901K achieves both high thermal conductivity and excellent insulation, contributing to the reliability of communication equipment. 【Usage Scenarios】 * Base stations * Servers * Routers * Optical fiber communication devices 【Benefits of Implementation】 * Prolonged device lifespan * Stabilization of performance * Reduced risk of failure
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**Features** * One-component heat-curing epoxy resin (no mixing required, high workability) * High thermal conductivity: 6.5W/m·K * Flame retardant: Equivalent to UL94 V-0 (5mm thickness) * High insulation and high heat resistance (Tg 110℃) * Suitable for heat dissipation and insulation sealing applications in electronic devices **Our Strengths** Terada Corporation has been providing its products and materials across various industrial sectors, focusing on electronic devices and chemical products. Utilizing our expertise in resin and adhesive technology along with years of know-how in the electronics industry, we contribute to solving our customers' challenges.
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■Small motor, coil, sensor, electronic component encapsulation ■Power device encapsulation
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Terada Corporation has been providing its own products and materials to various industrial sectors, focusing on electronic devices and chemical products. Utilizing our long-standing expertise in resin and adhesive technology within the electronics industry, we contribute to Japan, the world, and the planet.