TE-7814V for semiconductor packaging
Improving the reliability of semiconductor devices with high thermal conductivity and high Tg.
In the semiconductor industry, as devices become smaller and more high-performance, ensuring thermal management and long-term reliability has become an important challenge. Encapsulation materials require high thermal conductivity and heat resistance, and it is essential to maximize the performance of the devices. TE-7814V was developed to address these challenges. 【Application Scenes】 - Power modules - Electronic devices - Heat dissipation encapsulation for electronic components that generate heat 【Benefits of Implementation】 - Achieves effective heat dissipation with a thermal conductivity of 2.5W/mK - Ensures reliability in high-temperature environments with a high Tg of 185°C - Low viscosity design allows for compatibility with complex component shapes
basic information
【Features】 - Two-component heat-curing epoxy resin (mixing ratio 100/100) - Low viscosity, suitable for complex part shapes - High thermal conductivity: 2.5 W/m·K - High heat resistance: high Tg 185℃ - Flame retardant: equivalent to UL94 V-0 - High insulation properties ensure long-term reliability of electronic devices 【Our Strengths】 Terada Corporation has many years of experience in the electronic devices and chemical products fields, providing optimal products tailored to customer needs. We leverage our expertise in resin and adhesive technology, along with our know-how in the electronics industry, to contribute to solving customer challenges.
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Applications/Examples of results
【Applications】 ■ Sealing for small motors, sensors, and electronic components ■ Sealing for power devices *For more details, please download the PDF or feel free to contact us.
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Terada Corporation has been providing its own products and materials to various industrial sectors, focusing on electronic devices and chemical products. Utilizing our long-standing expertise in resin and adhesive technology within the electronics industry, we contribute to Japan, the world, and the planet.