TE-7820FR3 for semiconductors
High Tg, flame retardant, improved copper adhesion! Ideal for power device encapsulation.
In the semiconductor industry, particularly in fields that require high reliability, the performance of encapsulation materials for power devices is crucial. To withstand temperature changes and vibrations, and to ensure long-term reliability, excellent heat resistance, flame retardancy, and high adhesion to substrates are essential. TE-7820FR3 has been developed to address these challenges and enhance the performance and reliability of power devices. 【Application Scenarios】 - Power modules - Semiconductor packages 【Benefits of Implementation】 - Improved thermal, electrical, and mechanical performance - Assurance of long-term product reliability
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【Features】 - Two-component heat-curing epoxy resin (mixing ratio 100/100) - High strength and high heat resistance (Tg = 174°C) - Excellent thermal cycle resistance with a low coefficient of thermal expansion (20 ppm/K) - Flame retardant: equivalent to UL94 V-0 (2mm thickness) - High insulation properties (dielectric breakdown strength over 25 kV/mm, volume resistivity 4.0×10^16 Ω·cm) 【Our Strengths】 Terada Corporation has many years of experience in the fields of electronic devices and chemical products. We provide products tailored to our customers' needs and offer technical support as well.
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[Usage] ■ Sealing for small motors, sensors, and electronic components *For more details, please download the PDF or feel free to contact us.*
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Terada Corporation has been providing its own products and materials to various industrial sectors, focusing on electronic devices and chemical products. Utilizing our long-standing expertise in resin and adhesive technology within the electronics industry, we contribute to Japan, the world, and the planet.