Low-pressure sealing thermosetting dry molding material Bioglass [Developed Product]
We contribute to the miniaturization of automotive components and the reduction of processes.
Mitsubishi Gas Chemical Next (formerly Nippon Yupica) has developed a low-pressure thermosetting dry molding material called "Bioglass" for encapsulation of miniaturized electronic materials, which simultaneously achieves reduced production time and low-pressure molding with insert molding capabilities. Compared to conventional materials, it allows for significant productivity improvements due to rapid curing and post-curing elimination. It contributes to the "miniaturization" and "reduction of processes" in automotive components. *For more details, please refer to the PDF document or feel free to contact us.*
basic information
Features - High reliability - Low pressure sealing - High cycle - Post-cure less - High fluidity - Insulation and heat dissipation *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
It can be used for sealing various materials. *For more details, please refer to the PDF document or feel free to contact us.*
