Molding Material Bioglass
Molding Material Bioglass
Biloglass is a thermosetting dry molding material made from crystalline unsaturated polyester resin, possessing excellent properties such as electrical insulation, flame retardancy, and heat resistance. Compared to BMC molding materials, Biloglass excels in handling, moldability, and storage stability. It is available in various grades to meet different requirements, including heat-resistant grades, flame-retardant grades, high-strength grades, and heat-dissipating grades. Biloglass is ideal for applications in electrical equipment, electronic components, automotive electrical parts, and heat-resistant components, where high reliability is required. Unlike thermoplastic resins, it does not melt even when the ambient temperature rises, making it an optimal molding material that significantly enhances durability and safety performance.
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Thermosetting Dry Molding Material "Bioglass Technical Data"
Thermosetting dry molding materials suitable for applications such as electrical equipment, electronic components, automotive electrical parts, and heat-resistant parts that require high reliability!
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Low-pressure sealing thermosetting dry molding material Bioglass [Developed product]
Contributes to the miniaturization of automotive components and the reduction of processes.
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2022 Automotive Exhibition Exhibition Materials
This is the material exhibited at the "Automotive Exhibition" held at Tokyo Big Sight from January 19 to 21, 2022.
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Notice of Participation in the 2nd Automotive World [Autumn]
Exhibition of high-strength, fast-curing resins for CFRP, intermediate materials, and thermosetting molding materials for low-pressure sealing, etc.
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Automotive Exhibition 2023 Autumn Exhibition Materials
This is the exhibition material for the Automotive Exhibition 2023 Fall.
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Improved production efficiency with high-speed curing! Low-pressure sealing molding material 'Bioglass'.
Achieving a balance between mass production speed and quality. By utilizing low-pressure sealing, we realize process shortening and stable molding, contributing to improved productivity for automotive applications.
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High-reliability and excellent heat dissipation sealing material "Bioglass"
Supports the long lifespan of automotive electronic components with high insulation and heat dissipation performance. Maintains stable quality even under harsh conditions.
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Supports encapsulation of small devices! Dry-forming material 'Bioglass'
Designed for miniaturized electronic components. Compatible with insert molding, it reduces the number of parts and processes, contributing to space-saving.
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The optimal low-pressure molding material for encapsulating automotive electronic components: "Bioglass."
Supports mass production of automotive components with environmental resistance, heat dissipation, and fast curing. Contributes to reducing defects and improving production efficiency through low-pressure sealing.
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Dry molding material 'Bioglass' suitable for sealing for 5G and IoT applications.
Low-loss, high-reliability sealing materials required in the era of high-speed communication. Supports miniaturized components and aids in the production of next-generation communication devices.
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Low-pressure sealing material for consumer electronics! Productivity enhancement 'Bioglass'
Ideal for cost-conscious consumer markets. Strongly supports mass production with reduced processes, shortened cycles, and stable quality.
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Power module encapsulation support! Thermosetting material 'Viroglass'
Combines heat dissipation, dielectric strength, and adhesion. It meets high power applications while simultaneously achieving sealing quality and long lifespan.
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Bioglass for automobiles
Combining heat dissipation, dielectric strength, and adhesion properties to enhance the reliability of automobiles.
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Bioglass for home appliances
It combines heat dissipation, dielectric strength, and adhesion, contributing to the longevity of home appliances.
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Bioglass for industrial equipment
Thermosetting materials that combine heat dissipation, dielectric strength, and adhesion properties.
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