Supports encapsulation of small devices! Dry-forming material 'Bioglass'
Designed for miniaturized electronic components. Compatible with insert molding, it reduces the number of parts and processes, contributing to space-saving.
Mitsubishi Gas Chemical Next (formerly Nippon Yuka)'s "Biologlass" is a low-pressure thermosetting dry molding material suitable for sealing compact electronic devices. Its high fillability and low-pressure characteristics allow it to be used in insert molding processes. The post-cure-less design eliminates the need for additional processing, achieving simplification of the process and reduction of equipment load. 【Features】 - Insert molding capable - High flow & low-pressure sealing - Process reduction / space-saving - High reliability / heat dissipation design *For more details, please refer to the PDF materials or feel free to contact us.
basic information
Features - High reliability - Low pressure sealing - High cycle - Post-cure less - High fluidity - Insulation and heat dissipation *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
It can be used for sealing various materials. *For more details, please refer to the PDF document or feel free to contact us.
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Mitsubishi Gas Chemical Next (formerly Nippon Yupika) Co., Ltd. started with the unsaturated polyester resin business and has expanded into saturated polyester resins, epoxy acrylate resins (vinyl ester resins), urethane acrylate resins, and methacrylic esters. As a research and development-oriented manufacturer, we work closely with our customers to advance product development that meets their needs, providing materials widely for housing equipment, automotive and vehicle parts, electrical materials, coatings, and electronic and optical components. We also offer products that contribute to the global environment, such as resins that cure with ultraviolet or electron beams without using solvents, resins for powder coatings, and resins made from biomass materials.