Power module encapsulation support! Thermosetting material 'Viroglass'
Combines heat dissipation, dielectric strength, and adhesion. It meets high power applications while simultaneously achieving sealing quality and long lifespan.
In power device and module encapsulation, heat dissipation characteristics and insulation performance are emphasized. "Bioglass" enables uniform encapsulation down to fine details due to its high filling and low-pressure moldability. Its design reduces processes, contributing to production efficiency and quality stability in mass production. 【Features】 - Insulation & heat dissipation design - High reliability encapsulation - Low-pressure processing - Fast curing / process reduction - Compatible with module encapsulation *For more details, please refer to the PDF document or feel free to contact us.
basic information
Features - High reliability - Low pressure sealing - High cycle - Post-cure less - High fluidity - Insulation and heat dissipation *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
It can be used for sealing various materials. *For more details, please refer to the PDF document or feel free to contact us.*
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Mitsubishi Gas Chemical Next (formerly Nippon Yupika) Co., Ltd. started with the unsaturated polyester resin business and has expanded into saturated polyester resins, epoxy acrylate resins (vinyl ester resins), urethane acrylate resins, and methacrylic esters. As a research and development-oriented manufacturer, we work closely with our customers to advance product development that meets their needs, providing materials widely for housing equipment, automotive and vehicle parts, electrical materials, coatings, and electronic and optical components. We also offer products that contribute to the global environment, such as resins that cure with ultraviolet or electron beams without using solvents, resins for powder coatings, and resins made from biomass materials.