Easily achieve high magnification observation with our unique technology "User-Centric Mechanism." We support the discovery and analysis of defects in implementation boards and semiconductor devices.

Our company offers a 3D X-ray CT system that employs our unique technology, the "U-Centric Mechanism," allowing for easy and efficient observation at high magnification. In diagonal CT imaging, bringing the target area closer to the X-ray focus enables high-magnification tomographic imaging. This allows for detailed observation and strongly supports the discovery and analysis of defects in printed circuit boards and semiconductor devices. 【Features】 ◎ 'XVA-160RA' ■ A newly revamped model based on the standard model, compatible with high-resolution generators ■ Equipped with a nano-focus X-ray generator (focus size 250/800nm) ■ Enables clear observation of details at a magnification of 1,600 times ■ Features visible light mapping and automatic focus adjustment functions ◎ 'XVA-160αII "Z"' ■ A high-end model specialized for even higher magnification, capable of analyzing the internal structure of packages ■ Equipped with a nano-focus X-ray generator (focus size from 200nm) ■ Allows precise observation of detailed structures at a magnification of 2,000 times ■ Features a high-resolution top table, automatic adjustment functions for optical axis, rotation center, and focus

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