【UHS_X-ray CT System Imaging Case】Wire Bonding
This is a case of transmission imaging of wire bonding on a microSD card using a nano-focus X-ray CT system.
This is a case of X-ray imaging of the wire bonding of a microSD card. The wire bonding can be clearly observed. The device used for imaging, "XVA-160αII 'Z'," is an ultra-high-resolution nano-focus 3D X-ray CT system. It is an ultra-high-end model that achieves nano-order analysis and can perform CT imaging in just 3.5 minutes thanks to world-class oblique CT technology, contributing to improved efficiency in analysis. 【Features】 - A high-end model specialized for higher magnification, capable of analyzing the internal structure of packages. - Equipped with a nano-focus X-ray generator (focus size 200nm and above). - Precise observation of detailed structures at a high magnification of 2,000 times. - Features a high-resolution top table, automatic adjustment functions for optical axis, rotation center, and focus.
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Our company develops and manufactures non-destructive testing equipment centered around advanced X-ray devices, high-precision stages, and image processing technology. The XVA series, which utilizes a user-centric stage capable of rotational observation around any focal point, accurately meets the needs of customers seeking advanced quality assurance in manufacturing lines and implementation analysis at the nano level. In addition to inspecting printed circuit board soldering implementations, we support research, development, and manufacturing across a wide range of fields, including semiconductor products, various electronic devices, automotive components and related industries, materials and composites, and medical-related areas.