Features ● Onboard LPDDR5 memory 4GB/ 8GB/ 16GB (up to 16GB) ● Onboard eMMC storage 32GB/ 64GB (up to 64GB) ● 2.5GbE x 2 ● USB 3.2 x 3 (Type A x 2, Type C x 1) ● 40 pin GPIO x 1 ● DP 1.2 x 1 / DP 1.4a x 1 / HDMI 2.0b ● RS232 / 422 / 485 wafer x 2 ● M.2 2230 E-Key / M.2 2280 M-Key / M.2 3052 B-Key x 1 ● SATA3 x 1 ● TPM 2.0 ● 12V DC-in, 6A

Features ● 12th Generation Intel(R) Core(TM) i7/i5/i3/Celeron(R) Processor SoC ● Dual-channel LPDDR5 up to 16GB onboard ● M.2 2280 KEY M (PCIE Gen4) x2 ● 5G via M.2 3052 ● Intel AX210 WiFi 6 ● TPM 2.0 ● 40-pin HAT connector ● Technical support on community site www.upcommunity.org

Features ● Supports 12th/13th generation CPUs with LGA1700 socket and R680E chipset ● DDR5 4800MHz SO-DIMM x2 (up to 64GB) (sold separately) ● SATA III x4 ● M.2 M-key x2, M.2 E-key x1, M.2 B-key x1 ● 2.5 GbE x8, RS232 x3, PCIe Gen4x4 x1 ● MI23-R6802 has onboard TPM 2.0

Features ● Supports 12th/13th generation CPUs with LGA1700 socket, compatible with Q670E chipset ● DDR5 4800MHz SO-DIMM x2 (up to 64GB) (sold separately) ● SATA III x4 ● M.2 M-key x2, M.2 E-key x1, M.2 B-key x1 ● 2.5 GbE x8, RS232 x3, PCIe Gen4x4 x1 ● MI23-Q6702 has onboard TPM 2.0

Features ● Supports 12th/13th generation CPUs with LGA1700 socket, compatible with H610E chipset ● DDR5 4800MHz SO-DIMM x2 (up to 64GB) (sold separately) ● SATA III x4 ● M.2 M-key x1, M.2 E-key x1, M.2 B-key x1 ● 2.5 GbE x6, RS232 x3 ● MI23-H6102 has onboard TPM 2.0

Features: ● 12th Generation Intel(R) Core(TM) LGA1700 Processor ● TDP up to 95W for 6 cores ● DDR5 DRAM 4000MHz, supports up to 128GB (sold separately) ● HDMI2.0 x2, VGA x 1, DP x 2 supported ● Dual Intel(R) Gigabit Ethernet, i210AT x 1, i219V x 1 ● USB 3.2 Gen2 x 2, USB 3.2 Gen1 x 4, USB 2.0 x 3 ● SATA ports x 8 ● TPM 2.0 onboard

Features ● Supports 12th/13th generation CPUs with LGA1700 socket ● DDR5 DRAM x4 (up to 128GB) (memory sold separately) ● Supports independent 4-screen output (HDMI x1, DP x1, VGA x1, LVDS/eDP x1) ● M.2 Slot (M key) x2, M.2 Slot (B key) x1 + Micro SIM Slot x1, M.2 Slot (E key) x1 ● USB 3.2 Gen2 x4, USB 3.2 Gen1 x3, USB 2.0 x2 ● Onboard TPM 2.0

Features ● Supports 12th generation CPU with LGA1700 socket ● DDR5 DRAM x2 (up to 64GB) (memory sold separately) ● HDMI 2.0 x2, DP 1.2 x2 ● M.2 Slot (M-key; PCIex4; NVMe; 2280) x1, M.2 Slot (E-key; 2230) x1, M.2 Slot (B-key; 3042; 3052) x1 with SIM slot ● USB 3.2 Port x4, USB 2.0 Port x4 ● DC 12V input

Features ● Equipped with NVIDIA Jetson Orin NX ● USB 3.2 Gen 2 x 2, USB 2.0 type A x 2 ● COM, DIO, CANBus

Features: ● Equipped with NVIDIA Jetson Orin NX ● Fanless design ● 16GB LPDDR5x onboard ● HDMI2.0 x 1 ● M.2 Key E x 1, M.2 Key B x 1, M.2 Key M x 1 ● GbE LAN x 2 ● NVIDIA Jetpack 5.0 pre-installed

Features: ● Equipped with NVIDIA Jetson AGX Orin ● Fanless design ● PoE/PSE 802.3af x 4 (Max. 60W) ● RS-232/422/485 x 1, CANBUS x 1 ● 40-pin header, Mic in, Line out ● M.2 E key, M.2 M key, SATA storage

Features ● Onboard LPDDR5 memory 4GB/ 8GB/ 16GB (up to 16GB) ● Onboard eMMC storage 32GB/ 64GB (up to 64GB) ● 2.5GbE x 2 ● USB 3.2 x 3 (Type A x 2, Type C x 1) ● 40 pin GPIO x 1 ● DP 1.2 x 1 / DP 1.4a x 1 / HDMI 2.0b ● RS232 / 422 / 485 wafer x 2 ● M.2 2230 E-Key / M.2 2280 M-Key / M.2 3052 B-Key x 1 ● SATA3 x 1 ● TPM 2.0 ● 12V DC-in, 6A

Features ● 12th Generation Intel(R) Core(TM) i7/i5/i3/Celeron(R) Processor SoC ● Dual-channel LPDDR5 up to 16GB onboard ● M.2 2280 KEY M (PCIE Gen4) x2 ● 5G via M.2 3052 ● Intel AX210 WiFi 6 ● TPM 2.0 ● 40-pin HAT connector ● Technical support on community site www.upcommunity.org

Features ● Intel Celeron N6210/Pentium J6426 ● LPDDR4 2G/4G/8G/16G onboard memory ● 32G/64G onboard eMMC ● RJ-45 x 2 ● USB 3.2 Type A x 3 ● 40 pin GPIO x 1 ● DP 1.2 / HDMI 1.4b / eDP 1.3 ● RS232/422 pin header x 1 ● M.2 2230 E-Key x 1, M.2 2280 M-Key x 1, SATA3 x 1 ● Technical support on the community site www.upcommunity.org

Features ● Supports Intel 12th/13th generation CPUs with LGA1700 socket (maximum 65W TDP) ● Chipset: R680E ● DDR5 4800MHz SO-DIMM x2 (maximum 64GB) (memory sold separately) ● HDMI x1, DP x1, VGA x1, LVDS/eDP x1 ● COM x6 ● USB3.2 Gen2 x6, USB3.2 Gen1 x2, USB2.0 x3 ● Onboard TPM2.0 (only for MI225R6802)

Features ● Supports Intel 12th/13th generation CPUs with LGA1700 socket (maximum 65W TDP) ● Chipset: Q670E ● DDR5 4800MHz SO-DIMM x2 (maximum 64GB) (memory sold separately) ● HDMI x1, DP x1, VGA x1, LVDS/eDP x1 ● COM x6 ● USB3.2 Gen2 x6, USB3.2 Gen1 x2, USB2.0 x3 ● Onboard TPM 2.0 (only for MI225Q6702)

Features ● Supports Intel 12th/13th generation CPUs with LGA1700 socket (maximum 65W TDP) ● Chipset: H610/H610E ● DDR5 4800MHz SO-DIMM x2 (maximum 64GB) (memory sold separately) ● HDMI x1, DP x1, VGA x1, LVDS/eDP x1 ● COM x6 ● USB3.2 Gen2 x2, USB3.2 Gen1 x2, USB2.0 x5 ● Onboard TPM 2.0 (only for MI225H6102)

Features ● Equipped with Intel Core i9-12900E *optional upgrade available ● 64GB memory *optional upgrade available ● 512GB 3D TLC SATA SSD *optional upgrade available ● OS-less model (compatible with Win10/11) *optional add-on available ● HDMI x 2, DP x 2 ● USB 3.2 (Gen2) x2, USB 3.2 (Gen1) x4 ● BTO support available from a single unit

Features ● Equipped with Intel Core i9-12900E / i5-12500E ● 64GB memory installed *can be changed optionally (up to 128GB) ● 2TB HDD installed *can be changed optionally ● OS-less model (compatible with Win10) *can be added optionally ● HDMI x 1, VGA x 1, DP x 1 installed ● USB 3.2 x 4, USB 2.0 x 2, Gigabit LAN x 2

Features ● Choice of Intel Celeron J6412 / Atom x6413E ● Equipped with 16GB memory *Changeable as an option (up to 32GB) ● Equipped with 512GB 3D TLC SATA SSD *Changeable as an option ● OS-less model (compatible with Windows 10) *Changeable as an option ● Equipped with HDMI x1, VGA x1 ● USB3.0 x2, USB2.0 x4 ● BTO available from a single unit

Features ● Equipped with NVIDIA Jetson Orin NX ● USB 3.2 Gen 2 x 2, USB 2.0 type A x 2 ● COM, DIO, CANBus

Features: ● Equipped with NVIDIA Jetson Orin NX ● Fanless design ● 16GB LPDDR5x onboard ● HDMI2.0 x 1 ● M.2 Key E x 1, M.2 Key B x 1, M.2 Key M x 1 ● GbE LAN x 2 ● NVIDIA Jetpack 5.0 pre-installed

Features: ● Equipped with NVIDIA Jetson AGX Orin ● Fanless design ● PoE/PSE 802.3af x 4 (Max. 60W) ● RS-232/422/485 x 1, CANBUS x 1 ● 40-pin header, Mic in, Line out ● M.2 E key, M.2 M key, SATA storage

Features ● Equipped with 12th generation Intel(R) Core(TM) i9/i7/i5/i3/G6900TE/G6900E processors ● DDR5 SODIMM (up to 64GB) ● HDMI x 2, DP x 2 ● M.2 3052 (for 5G module) ● GbE x 3, 2.5GbE x 1 ● Compatible with Windows 11

Features ● Equipped with 12th generation Intel(R) Core(TM) i7-1270PE/i5-1250PE/i3-1220PE ● Dual-channel DDR5 SODIMM x 2 slots (memory sold separately) ● Supports M.2 2280 M Key NVMe SSD ● Wide operating temperature range (-20 to 60℃) (WT model required for memory and storage) ● Equipped with a total of 3 LAN ports: 2.5GbE x 2 and GbE x 1 ● Supports TPM 2.0

Features ● Equipped with DDR4 SO-DIMM x 1 (up to 32GB) ● USB 3.2 Gen 2 (10Gbps) x 3, USB 2.0 x 1 ● Intel 2.5GbE LAN x 1 (i226-LM) + GbE LAN x 1 (i219-LM) ● M.2 3052 B Key for 5G module support ● TPM 2.0 onboard

We are pleased to announce that we will be exhibiting at the "26th Embedded/Edge Computing Expo [Spring]" to be held at Tokyo Big Sight from April 5 (Wednesday) to April 7 (Friday), 2023! We will showcase AI compact edge PCs equipped with NVIDIA's Jetson series, the latest Orin AGX products, embedded boards and edge PCs featuring Intel's Alder Lake and Tiger Lake, as well as other peripheral devices. We will also demonstrate AI software and actual implementation case studies. We sincerely look forward to your visit. ■ Dates: April 5 (Wednesday) to April 7 (Friday), 2023 ■ Hours: 10:00 AM - 6:00 PM (until 5:00 PM on the final day) ■ Venue: Tokyo Big Sight, East Hall 5 ■ Our Booth Number: E43-6 (located immediately after entering from the East Hall 5 entrance).

Features ● Equipped with 11th generation Intel Core i7-1185G7E / i5-1145G7E / i3-1115G4E / Celeron 6305E ● DP1.4×2, HDMI 2.0×1, Type-C DP×1 ● 2.5 GbE×1, GbE×1, SATA III×1, 8bit DIO×1 * Line-in/Line-out/MIC are optional

Features ● Equipped with 12th generation Intel Core i7-1270PE / i5-1250PE / i3-1220PE ● DP1.4×1, HDMI2.0×1, Type-C DP×1 ● 2.5 GbE×1, GbE×1, SATA III×1, 8bit DIO×1

Features ● Supports 12th/13th generation CPUs ● Supports Q670 chipset ● GbE x1, 2.5GbE x1 ● SATA 6Gb/s x2 ● HDMI x1, DP x1, VGA x1, LVDS x1 ● COM x2