Wafer cleaning device "Double-sided scrub cleaning device (for research and development)"
It is possible to transport, wash, and dry without touching the front and back surfaces of the workpiece.
A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”; thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for more information.
basic information
For more details, please contact us or download the catalog to view it.
Price range
Delivery Time
Applications/Examples of results
Various wafer cleaning
