Wafer cleaning device "Double-sided brush cleaning device (for research and development)"
It is possible to transport, wash, and dry without touching the front and back surfaces of the work.
A single-wafer device that performs polishing slurry cleaning with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing is also performed. ■ Capable of simultaneous cleaning of both sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”; thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for review.
basic information
For more details, please contact us or download the catalog to view it.
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Applications/Examples of results
【Purpose】 Various wafer cleaning