Dual-side simultaneous scrub cleaning device for small diameter wafers (LT, SiC, etc. 2 to 6 inches)
A scrub cleaning device that allows for transportation and drying without touching the front and back of the workpiece! In addition to simultaneous cleaning of the front, back, and sides with a unique mechanism, it also supports combinations with ultrasonic showers and more.
A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing is also performed. ■ Capable of simultaneous cleaning of both sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”; thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog to view.
basic information
For more details, please contact us or download the catalog to view.
Price range
Delivery Time
Applications/Examples of results
【Purpose】 Various wafer cleaning
