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300mm Cassette-less Cleaning System

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300mm Cassette-less Cleaning System

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Used in the chemical polishing process after final polishing / Batch processing of 50 pieces / Achieving high purity of 19nμm/5 pieces

<Equipment Overview> This device is used in the chemical polishing process after final polishing. Its feature is that it places 25 wafers in the gaps of 25 wafers, creating a half pitch, allowing for the simultaneous processing of 50 wafers. It achieves a high purity of 19nμm / 5 pieces.

basic information

<Main Specifications> 1. Item to be cleaned: 300mm thickness 0.75t 2. Processing method: Dip processing without cassette 3. Processing speed: 50 sheets/5min (variable) 4. Cleanliness inside the device: 0.1μm Class 1 5. Pass line: FL+900±5mm manual set by hoop 6. Conveyance method: Front conveyance

Price range

Delivery Time

Applications/Examples of results

Chemical polishing process after final polish

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