Wafer edge mirror polishing device (Edge Polish)
Polishing equipment (Edge Polish) that performs mirror polishing, rough polishing, and cleaning using filtered water and pure water as the medium without slurry.
■Device Overview A flat surface polishing device (edge polisher) that performs mirror polishing, rough polishing, and cleaning using filtered water and pure water as the medium, without using slurry or long polishing belts. The elimination of slurry and long polishing belts achieves low maintenance, space-saving, and a simple mechanism. ■Examples of Applications Mirror finishing processing, mirror finishing processing, end face foreign matter cleaning. ■Target Objects - Suitable for thin materials of 150 to 200 μm - Various wafers: compounds, oxides, glass, quartz, silicon, ceramics Please consider adopting the device after evaluation and confirmation with the actual machine. Compatible with Orifura (V-notches are not supported). Custom design and manufacturing are available through automation and specification discussions.
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【Purpose】 ■Various wafer polishing