Surface treatment chosen in the semiconductor and electronics fields.

Surface treatment chosen in the semiconductor and electronics fields.
In the advancing miniaturization of semiconductor processes, a higher purity environment is required. In addition to physical dust, it is necessary to maintain various metal ions at certain levels during the manufacturing process. From that perspective, fluoropolymer coatings, which possess heat resistance, chemical resistance, and chemically inert properties, are widely used in various semiconductor manufacturing equipment, from small components to large containers.
31~49 item / All 49 items
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Ensures abrasion resistance and non-stick properties! A coating that facilitates the release of adhesive materials.
Fluorine-based and siloxane-based coating systems suitable for applications with mechanical loads.
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Super Durable Organic-Inorganic Composite Coating System "Bicoat(R)"
Incredible durability! A coating system suitable for applications with mechanical loads.
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High durability coating for injection molding molds "BicoatⓇ NYK-01"
Double the lifespan of surface treatment and significantly reduce mold replacement frequency!
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Mold for automotive motor parts - Release and wear-resistant coating 'Bicoat'
Durability improved by approximately 2 times! Dramatically enhanced productivity of injection molding molds.
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Doubling the durability of mold surface treatment in automotive motor parts manufacturing.
Durability improved by about 2 times! Dramatically enhanced productivity of injection molding molds.
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Explaining the features, advantages, and disadvantages of ETFE coating.
ETFE coating is a coating technology that uses ETFE, a copolymer of tetrafluoroethylene and ethylene.
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PFAS-free release agent 'MRS Coating' for logistics and packaging
Powerful adhesive tape can also be removed! Contributes to the efficiency of packaging work.
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Bi-Coat for Electronic Components: Improved Release Properties of Precision Molds
Improving the release properties of injection molding molds and achieving micron-level dimensional accuracy.
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Coating for inspection processes of semiconductor manufacturing equipment
Prevent damage, adhesion, and metal powder generation on wafers, and maintain a clean environment in the inspection process.
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Non-stick coating for semiconductor manufacturing equipment
Easily removes contaminants with low surface energy. A coating that significantly improves maintainability.
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Fluororesin coating for semiconductor manufacturing equipment
From transportation, cleaning, etching, CMP, plating, to inspection. Coating that supports a wide range of processes in semiconductor manufacturing.
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Fluororesin coating for plating tanks (anti-adhesion, chemical resistance)
Eliminate the risk of contamination from plating solutions. Provide long-term protection for plating tanks with fluororesin lining.
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Fluororesin coating for semiconductor devices (chemical resistance and corrosion prevention)
Resistant to strong acids, strong alkalis, and organic solvents. A chemical-resistant coating compatible with all processes in semiconductor manufacturing.
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Coating for Semiconductor Manufacturing Equipment Transport Processes
From preventing scratches and chips on the transport handle to measures against corrosion of the structure. Coatings that enhance the reliability of wafer transport.
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Fluororesin coating for semiconductor devices (purity and metal contamination prevention)
Control metal ion contamination at the ppb level. Protect high-purity processes with fluororesin.
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Coating for Cleaning Processes in Semiconductor Manufacturing Equipment
Corrosion prevention, prevention of metal ion leaching, and prevention of wafer scratches. Summarizing and solving the challenges of cleaning equipment.
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High-purity coating for semiconductor manufacturing equipment
Suppresses metal ion leaching to an extremely low level. Suitable for semiconductor manufacturing processes that require high purity.
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Electrostatic prevention fluororesin coating "Safron®" (static electricity countermeasure)
Eliminate particle and ESD defects caused by static electricity. Unique coating that achieves both static prevention and non-stick properties.
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Why do powders clog in pipes and hoppers? The mechanisms of adhesion and bridging.
"The powder does not come out of the hopper" and "it gets clogged in the piping." The causes are not just one. This explains the typical mechanisms of clogging and the countermeasures.
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