Announcement of Yamashita Material's participation in the Electronic Equipment Total Solution Exhibition/JPCA Show 2024 from June 12 to June 14, 2024, showcasing the latest flexible substrates all in one place.

山下マテリアル

We will be exhibiting at the JPCA Show 2024, the Total Solutions Exhibition for Electronic Devices. At this exhibition, various electronic circuits and mounting technologies used in electronic devices and information communication equipment, as well as new technologies and solutions such as sensors and E-Textiles (wearable technology) that are gaining traction, will be showcased together. By providing and proposing technical information, we aim to contribute to the development of the electronic circuit industry and related sectors. At our booth, we will display our flexible printed circuits (FPC), focusing on low-loss FPC and high-current FPC "BigElec." We invite you to take this opportunity to see our products up close and experience their innovative technology. Dates: From June 12 (Wednesday) to June 14 (Friday), 2024 Venue: Tokyo Big Sight, East Exhibition Hall Exhibition Booth: 4D-11 This is a valuable opportunity to experience innovative technology. We look forward to your visit. For more details about the exhibition, please refer to the following URL: https://www.jpcashow.com/show2024/

Date and time Wednesday, Jun 12, 2024 ～ Friday, Jun 14, 2024
10:00 AM ～ 05:00 PM
Capital 【Venue】 Tokyo Big Sight East Exhibition Hall 【Booth Number】 4D-11 【Access by Train】 1. Take the JR Saikyo Line or Rinkai Line to "Kokusai-Tenjijo Station." It is about a 7-minute walk from Kokusai-Tenjijo Station to Tokyo Big Sight. 2. Take the Yurikamome to "Tokyo Big Sight Station." It is about a 5-minute walk from Tokyo Big Sight Station to Tokyo Big Sight. 【Access by Bus】 TOKYO BRT, Toei Bus, and JR Bus Kanto connect Tokyo Big Sight with Toranomon, Shimbashi, Monzen-Nakacho Station, and Tokyo Station. For details, please check the websites of each bus company. TOKYO BRT: https://tokyo-brt.co.jp Toei Bus: https://tobus.jp/blsys/navim JR Bus Kanto: http://time.jrbuskanto.co.jp/bk04110.html 【Access by Car】 It takes about 10 minutes by car from the "Rinkai Fukutoshin" exit or the "Ariake" exit of the Shuto Expressway Bayshore Route. Due to heavy congestion in surrounding parking areas during the exhibition, we recommend using public transportation.
Entry fee Free

Related product information

Flexible Circuit Board Manufacturing Service for Short Lead Times and Small Batches
"FPC Manufacturing Case Studies" now available! Single-sided FPC production starts from 1 day and double-sided FPC production from 2 days, with production available from 1 piece. We also support pattern design and component assembly.

【List of Materials and Processing Methods】【Base Material】 Base Material Type: Polyimide Base Thickness: 12μm, 25μm, 50μm Copper Foil Thickness: 12μm, 18μm, 35μm Base Material Type: Liquid Crystal Polymer (LCP) Base Thickness: 50μm Copper Foil Thickness: 12μm 【Standard Coverlay/Resist】 Insulating Film Type: Polyimide Insulating Film Thickness: 12.5μm, 25μm Adhesive Thickness: 15μm, 25μm, 35μm Insulating Film Type: Liquid Crystal Polymer (LCP) Insulating Film Thickness: 50μm Resist Ink Type: Solder Resist for FPC 【Reinforcement Plate Types】 Polyimide Reinforcement Plate: 75μm, 125μm, 180μm, 225μm Glass Epoxy Reinforcement Plate: 0.5mm, 1.0mm, 1.6mm 【Surface Treatment Plating】 Electroless Gold Flash Plating (ENIG) Electrolytic Gold Plating Nickel Palladium Gold Plating (ENEPIG) Electrolytic Tin Plating Heat-Resistant Preflux 【Outline Processing Methods】 Simple Type Processing, Mold Processing, Laser Processing
High Current Compatible Flexible Circuit Board BigElec
Suitable for incorporation into curved and narrow spaces. It can form high current circuits with a thin shape and low inductance.

Maximum current value: 10A to 100A Maximum dimensions: 480mm × 200mm Supported layers: 2 layers to 8 layers Conductor thickness per layer: up to 100μm thick
Card edge compatible multi-layer separated flexible printed circuit board (FPC)
Can be used with bent shapes and supports high-speed transmission! Ideal for integration in tight spaces. Integration of connections between circuit boards is also possible. *There is a video that explains it in 2 minutes!

Flexible printed circuit boards (FPC) allow for partial bending processing unique to them, enabling high-density wiring through the formation of 100μm pitch wiring and vias with a land diameter of φ300μm or less. In addition to mounting package components like BGA, it is also possible to mount bare chips on the FPC and connect them using wire bonding.
Ground slit MSL structure flexible printed circuit board
The thinning of flexible substrates is effective for assembly in narrow spaces! Required in areas where low spring back and high bending flexibility are needed.

For more details, please refer to the PDF document or feel free to contact us.
YFC "Type with Shield (SFC)"
Excellent flexibility! An essential item in situations where EMC measures are necessary.

【Standard Specifications】 ■ Length: 20mm to 420mm ■ Terminal pitch: 0.3mm (staggered terminals), 0.5mm, 1.0mm ■ Terminal thickness ・0.2mm±0.03mm (for 0.3mm pitch) ・0.3mm±0.05mm (for 0.5mm and 1.0mm pitch) ■ Reinforcement plate: Strip length + 2mm ■ Copper foil: Electrolytic 18μm, rolled 18μm, rolled 35μm ■ Surface treatment: Electrolytic gold plating, lead-free solder plating *For more details, please refer to the PDF document or feel free to contact us.
Reduce reflection points! "Multilayer flexible substrate for high-speed transmission"
It is suitable for high-frequency applications in the tens of GHz range, and because it allows for high-density RF lines compared to PCBs, it is effective for miniaturizing products.

【Specifications】 ■Number of Layers: 3 to 8 layers ■Connection Via: Through Via, Blind Via, Filled Via ■Base Material: Polyimide, Liquid Crystal Polymer ■FPC Thickness: Approximately 200 to 800 μm ■Surface Treatment: Gold Flash, Nickel Palladium Gold, Lead-Free Solder Plating *For more details, please refer to the PDF document or feel free to contact us.
Low-loss flexible substrate
Combining PTFE base and low dielectric coverlay to produce various low-loss FPCs!

For more details, please refer to the PDF document or feel free to contact us.
Big Elec SMT Connect (High Current FPC Shunt Specification)
Flexible substrate that bends freely and supports high current! Easily connects in tight spaces! Big Elec SMT Connect.

Main line Big Elec with implemented receptacle Rated: 60A Receptacle: Hirose Electric BM25-4S/2-V(53) Layers: 4 layers Branch line Big Elec with implemented plug Rated: 10A, 20A Plug: Hirose Electric BM25-4P/2-V(53) Layers: 1 layer or 2 layers