Ground slit MSL structure flexible printed circuit board
The thinning of flexible substrates is effective for assembly in narrow spaces! Required in areas where low spring back and high bending flexibility are needed.
Achieving Thinness While Maintaining Transmission Characteristics! 【Features】 ■ This technology resolves the relationship between the thickness of the FPC and conductor loss, which is a challenge of microstrip lines. ■ By incorporating a slit design in the ground (GND) plane, it is expected to achieve a thinner FPC while maintaining transmission characteristics. ■ A 0mm slit processing is applied between patterns, accommodating a bendable 'slit shape'. *For more details, please refer to the PDF document or feel free to contact us.
basic information
For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Applications】 ■ Replacement for fine coaxial cables ■ Replacement for wire harnesses ■ Replacement for cables for medical devices *For more details, please refer to the PDF document or feel free to contact us.
News about this product（3）
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Announcement of Yamashita Material's participation in the Electronic Equipment Total Solution Exhibition/JPCA Show 2024 from June 12 to June 14, 2024, showcasing the latest flexible substrates all in one place.
We will be exhibiting at the JPCA Show 2024, the Total Solutions Exhibition for Electronic Devices. At this exhibition, various electronic circuits and mounting technologies used in electronic devices and information communication equipment, as well as new technologies and solutions such as sensors and E-Textiles (wearable technology) that are gaining traction, will be showcased together. By providing and proposing technical information, we aim to contribute to the development of the electronic circuit industry and related sectors. At our booth, we will display our flexible printed circuits (FPC), focusing on low-loss FPC and high-current FPC "BigElec." We invite you to take this opportunity to see our products up close and experience their innovative technology. Dates: From June 12 (Wednesday) to June 14 (Friday), 2024 Venue: Tokyo Big Sight, East Exhibition Hall Exhibition Booth: 4D-11 This is a valuable opportunity to experience innovative technology. We look forward to your visit. For more details about the exhibition, please refer to the following URL: https://www.jpcashow.com/show2024/
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[December 13, 2023 - December 15, 2023] Yamashita Material Announcement of Participation in SEMICON Japan 2023 Special Exhibition "7th FLEX Japan 2023"
We would like to inform you that we will be exhibiting at the special exhibition "7th FLEX Japan 2023" at SEMICON Japan 2023 from December 13 (Wednesday) to December 15 (Friday). FLEX Japan is the only international exhibition in Japan specializing in FHE (Flexible Hybrid Electronics). It will showcase a variety of the latest thin, lightweight, and bendable flexible electronics, as well as hybrid technologies combining rigid silicon semiconductors. Flexible devices can only be fully appreciated through seeing and touching them, which fosters discussion. We would be grateful if you could stop by the Yamashita Material booth during your visit. [Main Exhibits] - Long-term high-temperature durable FPC - Low-loss FPC - Big Elec (high-current FPC) We understand this is a busy time, but we sincerely look forward to your visit.
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Notice of Participation in MWE 2023 (Microwave Workshops and Exhibition) by Yamashita Material from November 29 to December 1, 2023.
We will be exhibiting at MWE 2023 (Microwave Workshops and Exhibition) held from November 29 to December 1, 2023. On that day, we will showcase flexible printed circuits (FPC) focusing on low-loss FPC and high-current FPC "BigElec." We invite you to take this opportunity to see our products and experience our innovative technology. Advance registration is required for entry. Please register using the following URL: https://f-vr.jp/mw/jizen23/
