High-speed transmission technology
High-speed transmission technology
We would like to introduce our flexible circuit board technology that meets the needs for high-speed and large-capacity transmission.
1～7 item / All 7 items
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Low-loss flexible substrate
Combining PTFE base and low dielectric coverlay to produce various low-loss FPCs!
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Ultra-fine circuit high-frequency flexible substrate
Combining PTFE base and low dielectric coverlay to produce various low-loss FPCs!
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Card edge compatible multi-layer separated flexible printed circuit board (FPC)
Can be used with bent shapes and supports high-speed transmission! Ideal for integration in tight spaces. Integration of connections between circuit boards is also possible. *There is a video that explains it in 2 minutes!
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Button-plated flexible printed circuit board (FPC)
Button-plated FPC that enables high-speed transmission, ultra-thinness, and flexibility in a new dimension.
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Ground slit MSL structure flexible printed circuit board
The thinning of flexible substrates is effective for assembly in narrow spaces! Required in areas where low spring back and high bending flexibility are needed.
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It's also okay to use it twisted! "Flexible substrate compatible with high-speed transmission connectors."
Supports high-speed transmission up to 15GHz! We have combined the high-speed transmission connectors from Irisoh Electronics with our flexible substrates.
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Low-rebound, high-speed transmission flexible substrate
Approximately one-third the rebound force compared to conventional structures! Low-rebound FPC for communication devices that combines noise reduction and high-speed transmission.
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