Low-rebound, high-speed transmission flexible substrate

Approximately one-third the rebound force compared to conventional structures! Low-rebound FPC for communication devices that combines noise reduction and high-speed transmission.

The low-rebound, high-speed transmission FPC adopts a stripline structure and is an excellent flexible substrate for noise countermeasures using shielding materials. Compared to conventional 3-layer FPCs, it is approximately 200μm thinner and reduces rebound force to about one-third, while keeping transmission loss at the same level or lower. This innovative FPC, developed for communication devices, is expected to improve assembly workability and be used in movable parts. 【Four Features】 1. Reduces transmission loss to the same level or lower compared to conventional 3-layer FPCs and decreases rebound force to about one-third. 2. Improves assembly workability and allows for use in movable parts. 3. Enhances noise countermeasures through the adoption of stripline structure and shielding materials. 4. Supports compact device design due to its thin profile. For more details, please refer to the PDF materials or feel free to contact us.

basic information

【Layer Structure】 ■Insulator ■Conductor GND Layer ■Adhesive ■Insulator (Polyimide) ■Adhesive ■Conductor RF Line ■Insulator (Polyimide) ■Adhesive ■Conductor GND Layer ■Insulator *For more details, please refer to the PDF document or feel free to contact us.

Price range

Delivery Time

The delivery time and price may vary depending on the quantity, so please feel free to contact us.

Applications/Examples of results

Low-rebound, high-speed transmission FPC can be applied to various uses by leveraging its high-speed transmission performance and low-rebound characteristics. ■ Servers and Data Centers ■ Medical Devices ■ High-Performance Computers, CPU Boards ■ Industrial Equipment ■ Security and Surveillance Systems *For more details, please refer to the PDF document or feel free to contact us.