High-density, miniaturization support technology
High-density, miniaturization support technology
The formation of patterns and the arrangement of vias at narrow pitches, along with blind vias, enable the miniaturization, lightweight, and thinness of FPCs. The miniaturization of FPCs makes them suitable for devices that require compactness.
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Button-plated flexible printed circuit board (FPC)
Button-plated FPC that enables high-speed transmission, ultra-thinness, and flexibility in a new dimension.
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Ultra-small diameter through-hole substrate with 4-layer filled blind vias.
Formation of through holes with a diameter of 25μm or less. Since components can be mounted on top of the vias, space-saving is achieved.
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Specification for filling holes! "Ultra-small diameter through hole."
It is possible to form through holes with a diameter of 25μm or less on double-sided FPC. Additionally, it is also possible to form holes with a minimum diameter of 20μm and a minimum pad diameter of 95μm.
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Ultra-fine circuit high-frequency flexible substrate
Combining PTFE base and low dielectric coverlay to produce various low-loss FPCs!
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Narrow pitch pad on beer flexible substrate
By directly providing vias on the pitch pad, we contribute to the high-density implementation of FPC.
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