Specification for filling holes! "Ultra-small diameter through hole."
It is possible to form through holes with a diameter of 25μm or less on double-sided FPC. Additionally, it is also possible to form holes with a minimum diameter of 20μm and a minimum pad diameter of 95μm.
"Ultra-small diameter through holes" are formed with a diameter of φ20μm on both sides of the FPC through laser processing. It is possible to create holes with a minimum diameter of 20μm and a minimum pad diameter of 95μm. By using through-hole plating to fill the holes and arranging the through holes on the pattern, it enables narrower pitch and contributes to the miniaturization of the product. 【Features】 ■ Formation of through holes with a diameter of Φ25μm or less on both sides of the FPC is possible. ■ The holes are filled with 15μm through-hole plating specifications. *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Standard Specifications】 ■Base Polyimide: 50um ■Conductor Thickness: 12um ■Hole Diameter (Top Side): φ 20um ■Hole Diameter (Bottom Side): φ 15um ■Land Diameter: 95um *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
