Printed Circuit Board / Service
Printed Circuit Board / Service
Yamashita Material supports various processes related to printed circuit boards. Please feel free to consult us about anything.
1～26 item / All 26 items
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High Current Flexible Circuit Board [*FPC Technology Catalog Available]
Slim shape compatible with high current. Can be curved, suitable for integration into narrow spaces. An alternative to busbars and harnesses.
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Low-loss flexible substrate
Combining PTFE base and low dielectric coverlay to produce various low-loss FPCs!
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Ultra-small diameter through-hole substrate with 4-layer filled blind vias.
Formation of through holes with a diameter of 25μm or less. Since components can be mounted on top of the vias, space-saving is achieved.
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Ground slit MSL structure flexible printed circuit board
The thinning of flexible substrates is effective for assembly in narrow spaces! Required in areas where low spring back and high bending flexibility are needed.
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4-layer blind via flexible circuit board
Space-saving is possible! Suitable for high-resolution imaging diagnostic devices that require miniaturization.
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Flexible flat cable that excels in bending and bending resistance, replacing FFC.
Standard specification products require no initial costs! They can be made to your specified length, number of cores, and pitch, and are compliant with UL certification standards.
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High-temperature resistant and oil-resistant flexible printed circuit board (FPC)
Compared to polyimide, it has low dielectric constant, low dielectric loss tangent, and low water absorption, resulting in excellent high-frequency transmission characteristics! It also has long-term heat resistance of 240°C.
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Achieved without adhesive! Long-term high-temperature durable flexible substrate.
Passed long-term heat resistance test at 200℃ for 1000 hours! High-temperature durable flexible substrate with insulation characteristics exceeding JIS standards.
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It's also okay to use it twisted! "Flexible substrate compatible with high-speed transmission connectors."
Supports high-speed transmission up to 15GHz! We have combined the high-speed transmission connectors from Irisoh Electronics with our flexible substrates.
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Reduce reflection points! "Multilayer flexible substrate for high-speed transmission"
It is suitable for high-frequency applications in the tens of GHz range, and because it allows for high-density RF lines compared to PCBs, it is effective for miniaturizing products.
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High Heat Resistance Heat Dissipation Flexible Circuit Board (FPC) *Compatible with 150°C environments
It can suppress discoloration during heating. Here are the test results using a double-sided panel.
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Achieving a thickness of 0.98mm with 12 layers! 'High-Density High-Multilayer Flexible Circuit Board'
When you want to implement high-density wiring with over 200 pins in a limited space! It can be bent for use, allowing for high-density wiring in a compact space.
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Space-saving with increased winding count! 'Multilayer Coil Flexible Circuit Board'
It can carry a larger current than a standard flexible circuit board, making it suitable for use in motors, power supply coils, and sensors.
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Specification for filling holes! "Ultra-small diameter through hole."
It is possible to form through holes with a diameter of 25μm or less on double-sided FPC. Additionally, it is also possible to form holes with a minimum diameter of 20μm and a minimum pad diameter of 95μm.
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Slit flexible substrate" *can also accommodate "twisting" and "torsion.
Widely used as alternatives for fine coaxial cables, wire harnesses, and cables for medical devices. The spacing and width of the slits can be specified!
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Achieving long-distance wiring with ultra-thin cables: "Long-Length Flexible Circuit Board"
Long-distance wiring in the meter class is achievable! Flexible printed circuit boards (FPC) can have their width and length freely determined, making them suitable for various fields.
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"ACF connection" *Lightweight, thin, suitable for low-temperature mounting around 180°C.
Minimum connection pitch: 75/75μm. By using anisotropic conductive film, connection of narrow pitch terminals is possible!
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Low-rebound, high-speed transmission flexible substrate
Approximately one-third the rebound force compared to conventional structures! Low-rebound FPC for communication devices that combines noise reduction and high-speed transmission.
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Metal-based heat dissipation substrate with low thermal expansion coefficient
For the electrical wiring in the engine room and the gasoline tank meter! Compared to glass epoxy substrates, it has a lower coefficient of thermal expansion and stronger resistance to heat.
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Ultra-fine circuit high-frequency flexible substrate
Combining PTFE base and low dielectric coverlay to produce various low-loss FPCs!
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Narrow pitch pad on beer flexible substrate
By directly providing vias on the pitch pad, we contribute to the high-density implementation of FPC.
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Flexible substrates for medical devices: long lengths / slitting / ultra-fine circuits
For applications such as endoscopes, catheters, CT scans, and analytical devices! Introducing our products for medical equipment.
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All LCP Flexible Printed Circuit Board (FPC)
Next-generation flexible substrate with high heat resistance, low loss, and chemical resistance, all made of LCP!
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FPC forming (bending) delivery
Bend and deliver, ready to use. Achieve labor savings and space-saving design with FPC processing!
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Heat-resistant solder resist ink "HRS-1-7W"
Resistant to high temperatures, ultraviolet rays, and chemical environments! A next-generation solder resist ink that combines functionality and reliability.
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Flexible Printed Circuit Board (FPC) Assembly Service
Consistent support from flexible printed circuit boards (FPC) to implementation.
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