Achieved without adhesive! Long-term high-temperature durable flexible substrate.
Passed long-term heat resistance test at 200℃ for 1000 hours! High-temperature durable flexible substrate with insulation characteristics exceeding JIS standards.
The "Long-term High-Temperature Durable Flexible Circuit Board" is an FPC that achieves long-term heat resistance without the use of epoxy-based adhesives, making it suitable for harsh conditions in high-temperature environments. Even after undergoing our unique long-term high-temperature test conditions of 200°C for 1000 hours, the insulation resistance, continuity resistance change rate, and dielectric strength meet the JIS passing standards. 【Main Features】 1. Achieves high-temperature durability with a structure that does not use epoxy-based adhesives. 2. Heat resistance suitable for long-term use in high-temperature environments. 3. Insulation properties are maintained even after the long-term high-temperature test of 200°C for 1000 hours. For more details, please refer to the PDF document or feel free to contact us.
basic information
[Test Method] ■ After long-term high-temperature exposure equivalent to 1000 hours at 200°C, wrap around a pin gauge with a diameter of 6.4mm to check the condition. - All LCP (adhesive-free) - Polyimide flexible substrate (with adhesive layer) *For more details, please refer to the PDF document or feel free to contact us.*
Price range
P4
Delivery Time
P4
Delivery times and prices vary depending on the quantity. Please feel free to contact us.
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
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News about this product（2）
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Notice of Yamashita Material's participation in SEMICON Japan 2024 (Booth Number: 3436) from December 11 to December 13, 2024.
Thank you very much for your continued support. This is the Sales Department of Yamashita Material Co., Ltd., Circutec Division. We will be exhibiting at SEMICON Japan 2024 from December 11 (Wednesday) to December 13 (Friday). You will be able to see examples and samples of solutions using flexible substrates. We would be grateful if you could stop by the Yamashita Material booth during your visit. *Exhibition Overview* SEMICON Japan 2024 - Dates: December 11 (Wednesday) to December 13 (Friday), 2024 - Venue: Tokyo Big Sight, East Exhibition Hall, East 3 Hall - Booth Number: 3436 *An entry badge is required for admission to the exhibition. Please register in advance on the website linked below and print out your entry badge before your visit.* [Main Exhibits] - Long-term high-temperature durable FPC - Low-loss FPC - Big Elec (high current FPC) We understand you may be busy, but we sincerely look forward to your visit.
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Yamashita Material has decided to exhibit at JPCA Show 2023! Showcasing the latest technologies and products in FPC.
Yamashita Material Co., Ltd. will exhibit at the JPCA Show 2023, part of the Total Solution Exhibition for Electronic Devices 2023, held at Tokyo Big Sight from May 31 (Wednesday) to June 2 (Friday), 2023. Our booth number is 5H-01 in Hall East 5. At this exhibition, we will introduce the latest technologies and products related to flexible printed circuits (FPC). Our staff will provide thorough explanations and answer any questions you may have. Please feel free to stop by. Advance registration is required for attendance. Please register in advance using the URL below and print out your visitor badge to bring with you. https://jpca2023.jcdbizmatch.jp/jp/Registration We look forward to contributing to your business through new technologies and products. We sincerely await your visit. See you at JPCA Show 2023!
