"ACF connection" *Lightweight, thin, suitable for low-temperature mounting around 180°C.
Minimum connection pitch: 75/75μm. By using anisotropic conductive film, connection of narrow pitch terminals is possible!
"ACF connection" allows for the simultaneous connection of multiple electrodes on a substrate through heating and pressurization. It enables reliable connection at fine pitch with low cost. Additionally, compared to connection methods such as soldering or connectors, it offers lightweight, thin design, and low-temperature mounting around 180°C. 【Features】 ■ Simultaneous connection of multiple electrodes on a substrate through heating and pressurization ■ Reliable connection at fine pitch achieved at low cost ■ Lightweight, thin design, and low-temperature mounting around 180°C *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Specifications】 ■ Minimum connection pitch: 75/75μm ■ Contact resistance: 5Ω or less ■ Insulation resistance: 50MΩ or more ■ ACF width/thickness: 2mm width/thickness 35μm ■ Heat tool: 3×35mm *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
