Metal-based heat dissipation substrate with low thermal expansion coefficient
For the electrical wiring in the engine room and the gasoline tank meter! Compared to glass epoxy substrates, it has a lower coefficient of thermal expansion and stronger resistance to heat.
The "metal-based heat dissipation substrate" is a substrate that improves heat dissipation through thermal conduction, alleviating thermal issues. There are applications in high-brightness LED lighting (for vehicles and floodlights), as well as in automotive electrical components, ECUs, EPS, and DC/DC converters. Compared to standard glass epoxy substrates, it has a lower thermal expansion coefficient and greater resistance to heat. 【Features】 ■ A substrate that improves heat dissipation through thermal conduction by using metal as the base ■ Compared to standard glass epoxy substrates, it has a lower thermal expansion coefficient and greater resistance to heat *For more details, please refer to the PDF materials or feel free to contact us.
basic information
【Lineup】 ■ Copper foil: 35μm, 70μm (105μm, 175μm) ■ Insulation layer: 80μm, 100μm, 120μm ■ Aluminum: 0.8mm, 1.0mm, 1.5mm (2.0mm) *A6062, A5052 *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Applications】 ■ High-brightness LED lighting (automotive, floodlights) ■ Automotive electrical components ■ ECU, EPS ■ Power MOSFET, IGBT ■ DC/DC converters *For more details, please refer to the PDF document or feel free to contact us.
