Flexible Printed Circuit Board (FPC) Assembly Service
Consistent support from flexible printed circuit boards (FPC) to implementation.
Yamashita Material offers a comprehensive service from FPC manufacturing to component mounting, inspection, and final packaging. We perform fine mounting in-house from 0402 chips to 0603 chips, and we also accommodate high-density mounting such as BGA and wire bonding. We provide flexible support from prototyping to mass production, achieving high-quality and efficient manufacturing with a rapid response time of as short as one day.
basic information
- Supported component sizes: 0402 chip to 0603 chip (in-house mounting compatible), BGA compatible, various irregular components supported - Solder types: Lead-free solder, eutectic solder, low melting point solder supported - Component insertion: Manual insertion of components not compatible with the mounter is possible, various forming supported, automatic insertion by inserter is also supported
Price information
Please consult us as it varies depending on the specifications.
Delivery Time
Applications/Examples of results
- Prototyping and mass production of electronic devices using FPC substrates - Fine mounting of 0402/0603 chips in compact devices - High-density substrates requiring BGA mounting and wire bonding - Electronic modules for automotive equipment, industrial equipment, communication equipment, and medical devices - Comprehensive support from prototyping evaluation in the development stage to mass production launch
