Ultra-fine circuit high-frequency flexible substrate
Combining PTFE base and low dielectric coverlay to produce various low-loss FPCs!
The "Ultra-Fine Circuit High-Frequency Flexible Substrate" is a flexible substrate designed for high-frequency applications in the GHz range, compatible with bare chip mounting. By using LCP (Liquid Crystal Polymer) with low dielectric properties as the core material and forming circuits using the SAP (Semi-Additive Process), it is possible to create transmission lines with a differential impedance of 100Ω at wiring pitches below 50μm. To accommodate wire bonding with bare chips, the mounting pads are treated with ENEPIG (Electroless Ni Pd Au plating) for surface treatment. One of the features of SAP is its high precision in circuit formation, with an accuracy of ±5μm, making it suitable for impedance control. *For more details, please download the PDF or contact us.*
basic information
Product Specification Example Below is an example of specifications. For inquiries regarding the specifications, please contact us. - Number of Layers: 2 layers - Interlayer Connection Via: Through Via (φ0.1mm and above) - Base Material: LCP (Liquid Crystal Polymer) - Cover Coat: Low Dielectric Coverlay, Solder Resist - Conductor Thickness: 20μm (Reference Value) - Line/Space: L/S=20μm/20μm (Reference Value) - Surface Treatment: Gold Flash Plating / ENEPIG (Electroless Ni/Pd/Au Plating) - Impedance Matching: Differential 100Ω±10% *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Notice of Yamashita Material's participation in KIMES 2025 (Booth Number: D730) from March 20 to March 23, 2025.
At the "KIMES2025" exhibition booth of Daitron Korea Co., Ltd., we will be showcasing Yamashita Material Co., Ltd.'s SAP-FPC, All-LCP, long FPC, and more. This exhibition is one of the largest medical device and healthcare technology exhibitions in Korea. Dates: March 20 to March 23, 2025 Venue: COEX (Seoul, Korea) Exhibition Booth: D730 (within the Daitron Korea booth) In addition to the above, we plan to display various other samples, so please come and experience them at the venue. We sincerely look forward to your visit. For more details about the exhibition, please refer to the following URL: https://www.kimes.kr/eng/exhibitor/detail/2148798972_2025_kor
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Notice of Participation in MWE 2023 (Microwave Workshops and Exhibition) by Yamashita Material from November 29 to December 1, 2023.
We will be exhibiting at MWE 2023 (Microwave Workshops and Exhibition) held from November 29 to December 1, 2023. On that day, we will showcase flexible printed circuits (FPC) focusing on low-loss FPC and high-current FPC "BigElec." We invite you to take this opportunity to see our products and experience our innovative technology. Advance registration is required for entry. Please register using the following URL: https://f-vr.jp/mw/jizen23/
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Yamashita Material has decided to exhibit at JPCA Show 2023! Showcasing the latest technologies and products in FPC.
Yamashita Material Co., Ltd. will exhibit at the JPCA Show 2023, part of the Total Solution Exhibition for Electronic Devices 2023, held at Tokyo Big Sight from May 31 (Wednesday) to June 2 (Friday), 2023. Our booth number is 5H-01 in Hall East 5. At this exhibition, we will introduce the latest technologies and products related to flexible printed circuits (FPC). Our staff will provide thorough explanations and answer any questions you may have. Please feel free to stop by. Advance registration is required for attendance. Please register in advance using the URL below and print out your visitor badge to bring with you. https://jpca2023.jcdbizmatch.jp/jp/Registration We look forward to contributing to your business through new technologies and products. We sincerely await your visit. See you at JPCA Show 2023!
