Card edge compatible multi-layer separated flexible printed circuit board (FPC)
Can be used with bent shapes and supports high-speed transmission! Ideal for integration in tight spaces. Integration of connections between circuit boards is also possible. *There is a video that explains it in 2 minutes!
The "Card Edge Compatible Multi-Layer Flexible Printed Circuit Board (FPC)" provided by our company is a multi-layer flexible circuit board designed to accommodate card edge connectors with double-sided contacts. By reducing the connection points between printed circuit boards and flexible circuit boards, a stable impedance line is formed, which is expected to improve signal integrity at high frequencies of 10 GHz and above. The substrate uses polyimide film, and soft resist ink is used as the insulating material, allowing for flexibility, making it suitable for installation in tight spaces. 【Features】 ■ A partially bendable structure that has similar functionality to rigid-flex boards, enabling the formation of highly reliable vias. ■ A structure that integrates flexible and rigid parts without connection points or via transitions, allowing for the formation of stable impedance lines. ■ High-density wiring is possible with 100μm pitch wiring and vias with a land diameter of 300μm or less. ■ Integration of connections between boards contributes to a reduction in assembly labor. *For more details, please refer to the PDF materials. Feel free to contact us with any inquiries.
basic information
Flexible printed circuit boards (FPC) allow for partial bending processing unique to them, enabling high-density wiring through the formation of 100μm pitch wiring and vias with a land diameter of φ300μm or less. In addition to mounting package components like BGA, it is also possible to mount bare chips on the FPC and connect them using wire bonding.
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Announcement of Yamashita Material's participation in the Electronic Equipment Total Solution Exhibition/JPCA Show 2024 from June 12 to June 14, 2024, showcasing the latest flexible substrates all in one place.
We will be exhibiting at the JPCA Show 2024, the Total Solutions Exhibition for Electronic Devices. At this exhibition, various electronic circuits and mounting technologies used in electronic devices and information communication equipment, as well as new technologies and solutions such as sensors and E-Textiles (wearable technology) that are gaining traction, will be showcased together. By providing and proposing technical information, we aim to contribute to the development of the electronic circuit industry and related sectors. At our booth, we will display our flexible printed circuits (FPC), focusing on low-loss FPC and high-current FPC "BigElec." We invite you to take this opportunity to see our products up close and experience their innovative technology. Dates: From June 12 (Wednesday) to June 14 (Friday), 2024 Venue: Tokyo Big Sight, East Exhibition Hall Exhibition Booth: 4D-11 This is a valuable opportunity to experience innovative technology. We look forward to your visit. For more details about the exhibition, please refer to the following URL: https://www.jpcashow.com/show2024/
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[December 13, 2023 - December 15, 2023] Yamashita Material Announcement of Participation in SEMICON Japan 2023 Special Exhibition "7th FLEX Japan 2023"
We would like to inform you that we will be exhibiting at the special exhibition "7th FLEX Japan 2023" at SEMICON Japan 2023 from December 13 (Wednesday) to December 15 (Friday). FLEX Japan is the only international exhibition in Japan specializing in FHE (Flexible Hybrid Electronics). It will showcase a variety of the latest thin, lightweight, and bendable flexible electronics, as well as hybrid technologies combining rigid silicon semiconductors. Flexible devices can only be fully appreciated through seeing and touching them, which fosters discussion. We would be grateful if you could stop by the Yamashita Material booth during your visit. [Main Exhibits] - Long-term high-temperature durable FPC - Low-loss FPC - Big Elec (high-current FPC) We understand this is a busy time, but we sincerely look forward to your visit.
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Notice of Participation in MWE 2023 (Microwave Workshops and Exhibition) by Yamashita Material from November 29 to December 1, 2023.
We will be exhibiting at MWE 2023 (Microwave Workshops and Exhibition) held from November 29 to December 1, 2023. On that day, we will showcase flexible printed circuits (FPC) focusing on low-loss FPC and high-current FPC "BigElec." We invite you to take this opportunity to see our products and experience our innovative technology. Advance registration is required for entry. Please register using the following URL: https://f-vr.jp/mw/jizen23/
