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An SDS (Safety Data Sheet) is a document that contains important information regarding the handling of chemical substances, relevant regulations, disposal and transportation methods, as well as hazards and toxicity. The applicable regulations for flux cleaning agents, the presence or absence of flash points, usage precautions, the necessity of protective equipment, and disposal methods are detailed over more than 10 pages. In this article, we will explain important points that we particularly want you to pay attention to, as well as frequently asked questions, in a column format. Please see the related links for more information.

This is the updated version (ver.2) of the popular document "Fundamentals of Flux Cleaning." In this revision, in addition to the existing content (how to choose cleaning agents and cleaning methods), we have added the basics of "Residue Evaluation (Analysis)." This document is recommended for those who are just starting with flux cleaning and for those who want to understand the entire process from cleaning to analysis. In addition to the purpose of cleaning and the fields where cleaning is necessary, we also explain the necessity and methods of chemical analysis, so please take a moment to read it.

What is substrate cleaning? Is substrate cleaning unnecessary? We provide a detailed explanation of areas where flux cleaning is necessary, among other topics. In Japan, many cases adopt no-clean paste, but cleaning has become essential to ensure high reliability. We also address the latest cleaning challenges, such as the impact of ionic residues and metal salts on insulation resistance, in this column. Recommended for those who: * Want to investigate the causes of defects despite cleaning * Want to know the latest cleaning challenges and evaluation criteria * Want to explain and promote substrate cleaning within their company, etc. Please see the related links for more information.

In recent years, the advancement of electronic devices has led to a demand for advanced bonding technologies that can withstand high temperatures, large currents, and high voltages. In particular, in power devices, there are increasing cases where conventional solder types do not provide sufficient performance. While high Pb solder and Au/Sn solder can be applied, the use of "sintered bonding" is expanding due to considerations such as environmental regulations and costs, as it can form a high-density bonding layer. This article will examine effective cleaning methods utilizing spray cleaning and ultrasonic cleaning, and introduce the features and application examples of the cleaning agents VIGON PE 305N and VIGON PE 216A for power electronics.

In current electronics assembly in Japan, rosin-based flux is predominantly used for soldering. However, due to the promotion of the SDGs and the growing interest in reducing environmental impact, there is an active evaluation of water-soluble flux, which is expected to reduce VOC emissions and cleaning burdens. This time, we will present an investigation into the actual cleaning conditions of water-soluble flux, which is recognized as easier to clean than rosin-based flux.