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As electronic devices become more advanced and compact, the importance of fine joint solder paste is increasing in high-reliability fields such as power semiconductors, automotive applications, and industrial equipment. From the perspective of ensuring reliability, there is a growing number of situations where a decision must be made on whether or not to perform flux cleaning, making the cleaning of high-performance solder paste and flux a new challenge. In this research, in collaboration with Japan Superior Co., we focused on the "high-reliability solder paste for fine joints" developed by the company, examining the cleaning characteristics in fine joints and verifying the usefulness of evaluation using FT-IR and SEM-EDS based on chemical analysis. Additionally, we introduce our one-stop technical support that covers everything from cleaning to analysis and process optimization. You can view the detailed content of the article through the related link.

Our company conducts residue analysis to examine contaminants such as flux and sinter. We support the identification of defect causes and the resolution of quality issues in manufacturing sites through our analysis and expertise in flux cleaning. We also conduct defect cause investigations to isolate the causes of issues such as assembly defects, as well as cleanliness evaluations to check the cleanliness and residue levels on circuit board surfaces. 【Features】 ■ Residue analysis to identify the presence and type of substances adhered to surfaces ■ Defect cause investigations analyzing foreign substances and causes using analytical equipment and expertise ■ Cleanliness evaluations for process management through regular analysis ■ Proposals for countermeasures and improvements, in addition to analysis results ■ Cleanliness analysis is also possible for flux cleaning agents and circuit boards from other manufacturers ■ Cleanliness verification methods compliant with ISO 9455-18:2024 *For more detailed information, please refer to the related links.

This joint research was conducted as part of ongoing verification based on the research results with Mr. Hiroki in 2025. In this study, we focused on the question of whether similar trends can be observed with rosin-based flux, and evaluated the impact of differences in cleaning and rinsing conditions on insulation reliability and surface condition. Furthermore, through comparisons with water-soluble flux, we also examined the differences in post-cleaning characteristics based on the type of flux. Detailed information about the article can be viewed through the related link.

Modern electronic devices are highly advanced, and even minor malfunctions can lead to significant incidents. Events that undermine insulation threaten the reliability of products, and one phenomenon that can contribute to this is ion migration, which has been considered a past issue. It has been said that this has been overcome due to the evolution of various insulating materials such as coatings and resists, as well as advancements in cleaning-free technologies. However, as the miniaturization and high density of electronic substrates rapidly progress, ensuring insulation has become increasingly difficult, and the risk of ion migration is once again on the rise. This article will explain why ion migration has become a trend again, exploring its mechanisms, specific countermeasures, and evaluation methods to assess the potential for its occurrence. You can view the detailed content of the article through the related links.

"Before the resin encapsulation of semiconductors." We have added a page to the technical document titled "Why Did the 'Silent Evolution' Occur?" The article provides a detailed explanation of the basic concepts of semiconductor resin encapsulation, as well as specific approaches to surface treatment that are key to maximizing quality. Additionally, the technical document systematically organizes the mechanisms behind the deterioration of insulation and the instability of resin bonding strength, and explains advanced insights into surface design and cleaning technologies that are essential for high-reliability devices. We encourage you to read it.