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Defects in the substrate are a serious issue that greatly undermines reliability. In this article, we will discuss 10 common defects that can occur in substrates, including those arising from soldering and assembly processes, as well as defects caused by chemical factors. We will explain the technical background, assessment methods, and countermeasures from the perspective of cleaning.

The circuit board, often referred to as the heart of electronic devices, plays a crucial role in determining the overall quality of the product. However, corrosion of the circuit board directly leads to issues such as circuit shorts and disconnections, which can reduce the reliability of electronic devices. In this article, we will explain how corrosion of the circuit board occurs, its mechanisms, preventive measures, and methods for identifying the causes in the event that corrosion does occur.

In recent years, electronic devices have been miniaturized, made more densely packed, and designed for higher voltages, especially in the automotive and power device sectors, where long-term use under harsh conditions is assumed. Under such conditions, even trace residues on devices can lead to corrosion, ion migration, and insulation degradation, ultimately resulting in market failures. Furthermore, changes in flux composition and the diversification of materials have made the nature of residues more complex than before. Against this backdrop, the importance of post-cleaning analysis is increasing. Cleaning is the process of removing flux residues and contamination, but to objectively demonstrate whether removal has been successful, verification through analysis is essential. While cleaning is a process of removal, analysis can be seen as a process that substantiates the results.

IPA (isopropyl alcohol) is an alcohol-based cleaning agent widely used for cleaning electronic components and equipment. However, in recent years, there has been an increasing demand for alternatives due to limitations in cleaning power, safety concerns, regulatory compliance burdens, and stable procurement. As a substitute for IPA, Zestron offers products that achieve both high cleaning power and safety. We support quality improvement and work environment enhancement across a wide range of applications, from flux cleaning to equipment maintenance. *For more detailed information, please refer to the related links. Feel free to contact us for further inquiries.

In the field of power semiconductors for automotive and industrial applications, the adoption of "sintering bonding" as a joining technology that achieves high resistance and high reliability against thermal stress is expanding, replacing solder bonding. Similar to no-clean solder bonding technology, sintering bonding is fundamentally designed to be "no-clean." However, the currently mainstream sintering bonding methods are conducted under high temperature and high pressure conditions, which can lead to the generation and adhesion of residues during the bonding process, potentially affecting subsequent processes and long-term reliability. Cleaning is one proposed solution to this issue. Although there is a "no-pressure" method for sintering bonding, its applications tend to be limited from the perspective of strength and reproducibility. Additionally, while it is residue-free, it is not "zero residue," so cleaning can also be a viable solution for achieving reliability. Detailed content of the technical column can be viewed through the related link.