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  Printed circuit board cleaning(17)

  The primary objective of cleaning printed circuit boards (PCBs) is to remove resin, flux residues, and other contaminants generated during product manufacturing from assembled boards and hybrid boards. In most low-end production processes, a "no-clean" treatment is considered sufficient; however, high-end printed circuit boards used in industries such as automotive, telecommunications, military, and aerospace require the use of appropriate cleaning agents. Targeted use of cleaning agents primarily aims to remove resin and active agent residues, positively impacting subsequent processes such as bonding and conformal coating. If residues remain on the board, there is a risk of heel cracks and delamination. In the coating process, residues can worsen wettability, leading to delamination of conformal coatings, which can cause failures (e.g., market defects). Using lead-free solder increases the risk due to the presence of resin and strong active agents. By using the latest cleaning agents for printed circuit boards, most flux residues can be removed, thereby reducing risks. Zestron's cleaning agents are compatible with aqueous, semi-aqueous, and solvent cleaning processes.

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  Power semiconductor cleaning(9)

  Zestron provides aqueous and solvent-based cleaners for the cleaning of power semiconductors (power electronics) such as DCB, IGBT modules, discrete components on lead frames, and power LEDs. Zestron's cleaners are appropriately suited for any process, such as bonding and molding, and deliver optimal results when conducting shear tests and power cycle tests. - Power module cleaning - Cleaning of lead frame-based and discrete components - Power LED cleaning

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  Package cleaning(4)

  Zestron offers water-based and solvent-based cleaning agents for packages such as flip chips, CMOS, and BGA. Zestron's cleaning agents can remove flux residues from the narrow gaps and capillaries between chips and substrates after processes like solder bump reflow. Additionally, they effectively eliminate streaks and particles from camera modules to improve image resolution. By removing flux residues and particles, they maintain optimal wettability of underfill materials. - Flip chip cleaning before underfill for flip chip packages - Void-free underfill for glass filters without residues - CMOS camera module cleaning - BGA and micro BGA cleaning after solder ball processes - BGA and micro BGA cleaning after solder ball processes

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  Metal mask cleaning(12)

  When manufacturing printed circuit boards, cream solder, adhesive, and thick film paste are printed using metal masks, plastic masks, or screens. Residues of cream solder and adhesive on the surface and openings of the metal mask can lead to printing errors and curing issues, making manual wiping cleaning or automatic cleaning processes for metal masks and screens essential. - Removal of Pb-free and eutectic solder (no-clean type) - Removal of thick film paste - Removal of adhesive - Automatic metal mask cleaning - Manual wiping metal mask cleaning - Preventing the disposal of printed circuit boards (PCBs) with printing errors through cleaning of misprinted boards - Back wiping cleaning of metal masks in printing machines

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  Metal mask cleaning (SMT printer)(4)

  In addition to the automatic cleaning of metal masks, it is important to perform back wiping cleaning of the metal mask in the printing machine to maintain optimal and excellent printing quality. The most crucial aspect of back wiping cleaning is the cleaning agent itself. It needs to have excellent cleaning properties, low consumption, and high compatibility with cream solder. During back wiping cleaning, the interaction between the flow of the cleaning agent passing through the openings and the cream solder cannot be avoided. Cleaning agents like IPA (isopropyl alcohol) can affect the viscosity of the cream solder, leading to accumulation and impacting printing quality. Additionally, IPA is volatile, resulting in very high consumption. Zestron's cleaning agents are characterized by their ability to wipe clean, low consumption, and no impact on the viscosity of cream solder. Zestron offers water-based and solvent-based cleaning agents developed for back wiping of metal masks and nano-coated metal masks in printing machines. Furthermore, Zestron's cleaning agents are approved by major printing machine manufacturers and metal mask manufacturers.

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  Printing error substrate(4)

  Cleaning the metal mask improves the printing results, but printing errors occur during the production process. When cleaning a substrate with printing errors, the main task is to remove the cream solder that has been mistakenly printed or applied onto the substrate. If a printing error occurs on a high-value double-sided board that has already been soldered on one side, being able to return the defective substrate to the production process without discarding it makes the cleaning process very valuable.

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  Palette cleaning(3)

  In the soldering process, gases and vapors are released from the carrier pallet. If the flux recovery device is not cleaned regularly, heat transfer will be hindered, and the amount of residue will significantly decrease. To maintain the functionality of the flux recovery device and extend its lifespan, regular maintenance is recommended. When cleaning the carrier pallet, the main focus is on removing severely baked-on flux residues. In wave soldering equipment, improper substrate placement or processes can lead to uneven soldering on the printed circuit board. The removal of flux residues from the flux recovery device and carrier pallet can be done using manual wiping and cleaning equipment. Zestron offers a variety of water-based maintenance cleaning agents developed for the removal of low solid content, rosin-containing substances, synthetic compounds, water-soluble cream solder, and severely baked-on flux residues caused by condensed gas release.

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  Reflow oven cleaning(5)

  In the soldering process, gases emitted from evaporated flux and solder resist accumulate on the inner surface of the reflow oven. When the accumulation of flux and the amount of released gas increase, the peak temperatures in each zone cannot be consistently reached, resulting in an unstable temperature profile. Furthermore, during subsequent reflow, contamination from the released gases is re-accumulated on the next substrate. Regular cleaning of the reflow oven contributes to the stability of the reflow process. Zestron offers water-based cleaning agents based on MPC(R) technology (Micro Phase Technology) and the latest surfactant-based cleaning agents based on FAST(R) technology (Fast-Acting Surfactant Technology). In addition to high cleaning performance, these products do not have a flash point compared to conventional alcohol products, allowing for use at warm surface temperatures and reducing downtime of the reflow oven due to maintenance.

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  Dispenser nozzle and jig cleaning(3)

  Cleaning of dispenser nozzles and related fixtures can be performed using automated processes such as hand wiping or ultrasonic cleaning. Zestron offers the latest adhesive removers based on modified alcohols. When used in automatic cleaning devices, these removers demonstrate superior cleaning power and longer liquid life. They are available in aerosol cans and various sizes of containers.

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  Cleaning Process Management(7)

  It was developed to optimize and manage the cleaning process and analyze the reliability of the cleanliness of electronic substrates and components.

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  Cleaning column(35)

  What is flux cleaning? What is a water-based cleaning agent? We will introduce useful information and technical details related to flux cleaning.

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  Technical data(18)

  What is a water-based cleaning agent? What is ionic residue? This explains the latest trends in flux cleaning.

Product/Service List (99)