Printed circuit board cleaning

The primary objective of cleaning printed circuit boards (PCBs) is to remove resin, flux residues, and other contaminants generated during product manufacturing from assembled boards and hybrid boards. In most low-end production processes, a "no-clean" treatment is considered sufficient; however, high-end printed circuit boards used in industries such as automotive, telecommunications, military, and aerospace require the use of appropriate cleaning agents. Targeted use of cleaning agents primarily aims to remove resin and active agent residues, positively impacting subsequent processes such as bonding and conformal coating. If residues remain on the board, there is a risk of heel cracks and delamination. In the coating process, residues can worsen wettability, leading to delamination of conformal coatings, which can cause failures (e.g., market defects). Using lead-free solder increases the risk due to the presence of resin and strong active agents. By using the latest cleaning agents for printed circuit boards, most flux residues can be removed, thereby reducing risks. Zestron's cleaning agents are compatible with aqueous, semi-aqueous, and solvent cleaning processes.

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