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In the manufacturing process of industrial components, foreign substances remaining on the surface of parts or in fine gaps can significantly affect the reliability and yield of the products. Ultrasonic cleaning is one method of precision cleaning that can physically address such invisible fine dirt. However, if the ultrasonic cleaning equipment is not properly set according to the material and shape of the workpiece, as well as the nature of the dirt, not only will sufficient effectiveness not be achieved, but there is also a risk of damaging the workpiece. In this column, we will explain the principles and mechanisms of ultrasonic cleaning, as well as key points for selecting equipment and constructing the cleaning process.

We have added a page for "Flux Cleaning Agent." This product selectively removes flux residues and is a water-based cleaning agent that supports the quality and reliability of electronic devices. Conventional solvent-based cleaning agents primarily rely on dissolving action to remove flux residues, but this product simultaneously exhibits both peeling and dissolving actions through its unique cleaning technology. 【Features】 ■ High cleaning performance due to unique cleaning technology ■ Removal of oxide films and prevention of re-oxidation during cleaning ■ Increased bonding strength through cleaning ■ High safety due to being a water-based cleaning agent

"VIGON UC 160" is a water-based cleaning agent specifically designed for use in printing machines to remove cream solder that adheres to the backside of metal masks. It demonstrates stable cleaning performance due to appropriate wetting spread, contributing to the stabilization of printing conditions and the suppression of various printing defects. Furthermore, it excels in safety and is suitable as a substitute for IPA. We are providing samples to confirm the cleaning ability and usability of this product. Please feel free to contact us.

In the manufacturing environment of electronic devices, quality issues can arise due to foreign substances and residues. SEM-EDS analysis is widely used as an analytical method to help identify the causes of these issues. This article will introduce the basic principles of SEM-EDS, what can be understood from the analysis, and specific case studies of the analysis.

Defects in the substrate are a serious issue that greatly undermines reliability. In this article, we will discuss 10 common defects that can occur in substrates, including those arising from soldering and assembly processes, as well as defects caused by chemical factors. We will explain the technical background, assessment methods, and countermeasures from the perspective of cleaning.