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In manufacturing sites and product development, invisible contaminants and unidentified foreign substances can lead to significant quality issues. The technology that can identify the chemical structure of organic substances in response to these challenges is "FT-IR analysis (Fourier Transform Infrared Spectroscopy)." FT-IR analysis is a fundamental analytical method widely used in chemical analysis, characterized by its ability to perform non-destructive measurements repeatedly and to identify organic compounds with high precision. This article will explain the principles and features of FT-IR analysis, the measurement targets and methods, as well as case studies and how it differs from other methods.

In the manufacturing process of industrial components, foreign substances remaining on the surface of parts or in fine gaps can significantly affect the reliability and yield of the products. Ultrasonic cleaning is one method of precision cleaning that can physically address such invisible fine dirt. However, if the ultrasonic cleaning equipment is not properly set according to the material and shape of the workpiece, as well as the nature of the dirt, not only will sufficient effectiveness not be achieved, but there is also a risk of damaging the workpiece. In this column, we will explain the principles and mechanisms of ultrasonic cleaning, as well as key points for selecting equipment and constructing the cleaning process.

We have added a page for "Flux Cleaning Agent." This product selectively removes flux residues and is a water-based cleaning agent that supports the quality and reliability of electronic devices. Conventional solvent-based cleaning agents primarily rely on dissolving action to remove flux residues, but this product simultaneously exhibits both peeling and dissolving actions through its unique cleaning technology. 【Features】 ■ High cleaning performance due to unique cleaning technology ■ Removal of oxide films and prevention of re-oxidation during cleaning ■ Increased bonding strength through cleaning ■ High safety due to being a water-based cleaning agent

"VIGON UC 160" is a water-based cleaning agent specifically designed for use in printing machines to remove cream solder that adheres to the backside of metal masks. It demonstrates stable cleaning performance due to appropriate wetting spread, contributing to the stabilization of printing conditions and the suppression of various printing defects. Furthermore, it excels in safety and is suitable as a substitute for IPA. We are providing samples to confirm the cleaning ability and usability of this product. Please feel free to contact us.

In the manufacturing environment of electronic devices, quality issues can arise due to foreign substances and residues. SEM-EDS analysis is widely used as an analytical method to help identify the causes of these issues. This article will introduce the basic principles of SEM-EDS, what can be understood from the analysis, and specific case studies of the analysis.