Metal mask cleaning (SMT printer)

In addition to the automatic cleaning of metal masks, it is important to perform back wiping cleaning of the metal mask in the printing machine to maintain optimal and excellent printing quality. The most crucial aspect of back wiping cleaning is the cleaning agent itself. It needs to have excellent cleaning properties, low consumption, and high compatibility with cream solder. During back wiping cleaning, the interaction between the flow of the cleaning agent passing through the openings and the cream solder cannot be avoided. Cleaning agents like IPA (isopropyl alcohol) can affect the viscosity of the cream solder, leading to accumulation and impacting printing quality. Additionally, IPA is volatile, resulting in very high consumption. Zestron's cleaning agents are characterized by their ability to wipe clean, low consumption, and no impact on the viscosity of cream solder. Zestron offers water-based and solvent-based cleaning agents developed for back wiping of metal masks and nano-coated metal masks in printing machines. Furthermore, Zestron's cleaning agents are approved by major printing machine manufacturers and metal mask manufacturers.