Metal Mask Back Cleaning Agent VIGON UC 160
Remove IPA, safe and environmentally friendly! Excellent wettability against non-woven fabric significantly reduces the surrounding area of cream solder.
VIGON UC 160 is a water-based cleaning agent specially designed for use in printers to remove cream solder from metal masks. It has excellent wettability on non-woven fabrics, improving cleaning performance and significantly reducing the residue around the cream solder. As a result, it can suppress solder bridges on the circuit board, leading to reliable printing results. Additionally, it is ideal as a substitute for IPA due to its excellent health and safety properties. 【Features】 ■ Cleaning of the back of metal masks in printers ■ Environmentally friendly and highly safe water-based cleaning ■ No negative impact on paste printability ■ Cost benefits from reduced paper usage ■ Reduced defect rates due to high cleaning performance *For more details, please refer to the PDF document or feel free to contact us.
basic information
In Japan, solvents such as IPA are widely used for cleaning the back side of metal masks inside printers, but due to the growing awareness of environmental and safety issues, water-based cleaning has already become common in Europe. VIGON UC 160, provided by Zestron, is a water-based cleaning agent specifically developed for cleaning metal masks inside printers. It not only takes safety and environmental considerations into account but also does not negatively impact the printability of the paste, reduces paper consumption, and lowers process costs. Zestron also provides precautions for switching from IPA. *We offer free support for trial attendance, so please feel free to consult with us.*
Price range
Delivery Time
Model number/Brand name
VIGON
Applications/Examples of results
Certified by domestic and international printer manufacturers, with numerous achievements at board assembly manufacturers.
