Package cleaning
Package cleaning
Zestron offers water-based and solvent-based cleaning agents for packages such as flip chips, CMOS, and BGA. Zestron's cleaning agents can remove flux residues from the narrow gaps and capillaries between chips and substrates after processes like solder bump reflow. Additionally, they effectively eliminate streaks and particles from camera modules to improve image resolution. By removing flux residues and particles, they maintain optimal wettability of underfill materials. - Flip chip cleaning before underfill for flip chip packages - Void-free underfill for glass filters without residues - CMOS camera module cleaning - BGA and micro BGA cleaning after solder ball processes - BGA and micro BGA cleaning after solder ball processes
1～4 item / All 4 items
-
Neutral flux cleaner for semiconductors - HYDRON SE 220
Excellent material compatibility! It is possible to remove flux residues generated during die attachment and finish the subsequent processes to an optimal surface condition.
last updated
-
Water-based flux cleaning agent for semiconductors HYDRON SE 230A
Low surface tension is a characteristic! It provides good cleaning results even in narrow spaces.
last updated
-
Flux cleaner ZESTRON FA+
Cleaning agent for printed circuit boards, power modules, and lead frames. Excellent cleaning power and long lifespan, suitable for a wide range of applications!
last updated
-
Cleaning Test [Consistent support from cleaning to cleanliness analysis]
After the test is completed, a technical report detailing recommended processes and other information will be submitted!
last updated
