Palette cleaning

In the soldering process, gases and vapors are released from the carrier pallet. If the flux recovery device is not cleaned regularly, heat transfer will be hindered, and the amount of residue will significantly decrease. To maintain the functionality of the flux recovery device and extend its lifespan, regular maintenance is recommended. When cleaning the carrier pallet, the main focus is on removing severely baked-on flux residues. In wave soldering equipment, improper substrate placement or processes can lead to uneven soldering on the printed circuit board. The removal of flux residues from the flux recovery device and carrier pallet can be done using manual wiping and cleaning equipment. Zestron offers a variety of water-based maintenance cleaning agents developed for the removal of low solid content, rosin-containing substances, synthetic compounds, water-soluble cream solder, and severely baked-on flux residues caused by condensed gas release.