Reflow oven cleaning
Reflow oven cleaning
In the soldering process, gases emitted from evaporated flux and solder resist accumulate on the inner surface of the reflow oven. When the accumulation of flux and the amount of released gas increase, the peak temperatures in each zone cannot be consistently reached, resulting in an unstable temperature profile. Furthermore, during subsequent reflow, contamination from the released gases is re-accumulated on the next substrate. Regular cleaning of the reflow oven contributes to the stability of the reflow process. Zestron offers water-based cleaning agents based on MPC(R) technology (Micro Phase Technology) and the latest surfactant-based cleaning agents based on FAST(R) technology (Fast-Acting Surfactant Technology). In addition to high cleaning performance, these products do not have a flash point compared to conventional alcohol products, allowing for use at warm surface temperatures and reducing downtime of the reflow oven due to maintenance.
1～5 item / All 5 items
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Reflow oven spray cleaner VIGON RC 303
Water-based flux cleaner suitable for cleaning chain conveyor claws in reflow ovens. Easy to work with and manage, and it finishes beautifully!
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Palette Reflow Furnace Component Cleaning Agent ATRON SP 300
It can reliably remove baked-on flux, with low odor and low running costs!
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Cleaning agent for pallet reflow furnace components - ATRON SP 300
Low odor with excellent cleaning ability! Enhanced cleaning performance and longer lifespan with device use!
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ATRON SP 200 [Palette Flux Recovery Device Cleaning Agent]
No ignition point, safe, low VOC, and environmentally friendly! Long liquid life and stable cleaning properties of water-based flux cleaning agents.
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Cleaning Test [Consistent support from cleaning to cleanliness analysis]
After the test is completed, a technical report detailing recommended processes and other information will be submitted!
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