株式会社TECHNICAL INFOMATION INSTITUTE CO.,LTD Official site

Mechanisms of easy disassembly (adhesive) bonding, material design, functional evaluation, and its applications.

株式会社TECHNICAL INFOMATION INSTITUTE CO.,LTD

■ Speakers 【Part 1】 Representative of APS Research, Mr. Kazutaka Wakabayashi 【Part 2】 Professor Chiharu Tokoro, Ph.D. (Engineering), Waseda University Graduate School of Science and Engineering, University of Tokyo Graduate School of Engineering 【Part 3】 Professor Emeritus, Doctor of Engineering, Mr. Makoto Tanaka, Niigata University 【Part 4】 Specialist, Tape and Adhesive Products Technology Department, 3M Japan Co., Ltd., Mr. Osamu Kishizaki ■ Event Details Date and Time: September 11, 2023 (Monday) 10:15 AM – 4:30 PM Venue: Live streaming via Zoom *No lectures will be held at a physical venue Please check "here" for connection confirmation and attendance procedures for the live seminar. Participation Fee: 60,500 yen per person (including tax, with materials) [55,000 yen per person only for companies applying with two or more participants simultaneously] [Discounts are available for individuals from universities, public institutions, and medical institutions. For details, please see the "Academic Price" section above.]