Fanless Embedded PC Arestech BPC-5080-2A1
Supports 9th/8th generation Coffee Lake Core i CPUs, designed for compact embedded systems.
Features ■ Width 238 × Height 61 × Depth 245 mm, 3.56 liters ■ Fanless 9th/8th generation Core i9/i7/i5/i3 Desktop (TDP 35W) LGA1151 CPU ■ 2 DDR4 2400/2666, maximum 64GB ■ Display output: DP x 3 / DP x 2, VGA x 1 ■ 2 GbE / 4 USB 3.1 + 4 USB 2.0 / 3 COM ■ 2.5" SATA HDD x 2 / M.2 x 1 ■ Wide DC input 19–28V ■ Extended operating temperature -20–60℃
basic information
Specifications ■CPU: 9th/8th Generation Core i9/i7/i5/i3 Desktop (TDP 35W) LGA1151 ■Memory: DDR4-2666 SODIMM x 2 (up to 64GB (Core i9/i7/i5) / 32GB (i3/Pentium/Celeron)) ■Storage: 2.5" SATA HDD x 2, M.2 M Key 2242/2260/2280 (SATA3) x 1 ■I/O Interface: 10/100/1000Base-T x 2 (1 I219-V, 1 I210-AT) (RJ-45), USB3.1 x 4, USB2.0 x 4, RS-232 x 2, RS-232/422/485 x 1 (DB9), DP x 2, VGA x 1, Audio ■Expansion Slot: M.2 E Key 2230 x 1, PCIe Mini x 1 ■Operating Temperature: -20~60° C ■Dimensions/Weight: 238 x 61 x 245 mm / 3.22 kg ■Shock Resistance: 20 Grms, Half-sine 11 ms ■Vibration Resistance: 1 Grms, 5-500 Hz, 3 Axis ■Certification: CE / FCC Class A
Price information
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Model number/Brand name
Arestech BPC-5080-2A1
Applications/Examples of results
Factory, machinery, etc.
Line up（3）
| Model number | overview |
|---|---|
| BPC-5080-1A1 | Supports 9th/8th generation Core i CPU (TDP 35W), Q370 |
| BPC-5080-2A1 | Supports 9th/8th generation Core i CPU (TDP 35W), H310 |
| Option | CPU: Core i7-9700T/8700T/i5-8500T/i3-8100T/Pentium G5400T/Celeron G4900T |
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Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.