Suntex Co., Ltd.株式会社 Official site

SECO CPU Module Trizeps VIII Mini

Trizeps SODIMM-200 CPU module, NXP i.MX 8M Mini family

Features ■ Equipped with NXP i.MX 8M Mini application processor ■ Supports 1x Gigabit Ethernet, WiFi/Bluetooth, USB 2.0, LVDS ■ GC3202D accelerator + GCNanoUltra3D accelerator ■ Onboard LPDDR4-3200 memory up to 8GB ■ Operating temperature 0 to 70℃ (optional: -40℃ to 85℃) ■ Dimensions: 67.6 x 36.7 x 6.4 mm ■ OS Win10 IoT/Debian/Yocto/Android

Santex Co., Ltd.

basic information

Specifications ■CPU Based on ARM Cortex-A53 core NXPi.MX8M Mini family + general-purpose Cortex-M4 400MHz processor: • i.MX8M Mini Quad - Full-featured 4x Cortex-A53 cores up to 1.8GHz • i.MX8M Mini Dual - Full-featured 2x Cortex-A53 cores up to 1.8GHz • i.MX8M Mini Solo - Full-featured 1x Cortex-A53 core up to 1.8GHz • i.MX8M Mini Quad Lite - 4x Cortex-A53 cores up to 1.8GHz, no VPU • i.MX8M Mini Dual Lite - 2x Cortex-A53 cores up to 1.8GHz, no VPU • i.MX8M Mini Solo Lite - 1x Cortex-A53 core up to 1.8GHz, no VPU ■Memory Onboard LPDDR4-3200 up to 8GB ■I/O Interface 1x Gigabit Ethernet, WiFi/Bluetooth, USB 2.0, LVDS ■Dimensions 67.6 x 36.7 x 6.4 mm ■Operating Temperature 0 to 70°C (Optional -40°C to 85°C)

Price range

Delivery Time

Please contact us for details

The delivery time may vary depending on the quantity, so please feel free to contact us.

Model number/Brand name

SECO Trizeps VIII Mini (by Keith & Koep)

Applications/Examples of results

Factory and building automation / control systems / communication systems / monitoring systems

Detailed information

SECO Trizeps SODIMM-200 CPU Module Trizeps VIII Product Catalog

PRODUCT

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Distributors

Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.