● Based on the NXP i.MX 95, it achieves AI performance of up to 2 TOPS. Compliant with SGeT SMARC 2.2 and OSM 1.2, it provides scalable and efficient edge intelligence. ● OSM-IMX95: A robust 45mm x 45mm solderable module adopting ADLINK's single-sided PCB design. It offers AI-driven performance for compact, power-constrained edge devices. ● SMARC LEC-IMX95: An 82 mm x 50 mm SGeT SMARC 2.2 module. Equipped with 10 GbE, secure boot, and industrial reliability, it enables intelligent IoT and automation. ● Providing customized high-performance edge solutions for various industries through diverse options and flexible ODM customization.

● AI-enabled high performance: Equipped with an integrated NPU and optionally compatible with NVIDIA GPUs, enabling scalable edge AI workloads. ● Modular I/O and flexible scalability: Supports function modules, spare signals, and extensive I/O customization to adapt to diverse application needs. ● Open-frame industrial design: Robust structure and wide operating temperature range allow for seamless integration into kiosks, machines, terminals, and more. ● High-quality display: Features industrial-grade AUO panels with ADLINK's unique customizations, including optical bonding, high brightness, anti-reflection, and UV protection.

●Equipped with AMD Ryzen Embedded 8000 series processors, achieving overwhelming performance. ●Accelerates multitasking and immersive visual experiences with 8-core, 16-thread processing powered by AMD RDNA 3 graphics. ●Achieves up to 40 TOPS of AI inference performance with Zen 4, RDNA 3, and XDNA architectures, enhancing on-device intelligence. ●Supports ECC-enabled DDR5 memory up to 96GB, ensuring reliable data integrity and system stability. ●Compatible with a variety of multi-display configurations (DP, eDP, HDMI, LVDS, VGA), flexibly accommodating complex visual setups.

●Wide voltage input: Supports 12-28V DC input, ensuring stable operation even in environments with unstable power. ●Balanced performance: Supports Intel Core CPUs with a maximum of 65W using PCIe 4.0, DDR4, and dual 2.5GbE. ●Ideal design for industrial applications: The Mini-ITX form factor and rich expandability enable seamless integration into embedded systems.

● Next-generation DLAP expandable edge AI platform: Built to meet the rapidly growing demand for edge AI solutions with flexible scalability and robust design. ● High-performance AI computing: Achieves scalable AI processing capabilities of up to 91.1 TFLOPS with support for NVIDIA RTX 6000 ADA GPU, enabling real-time decision-making at the edge. ● Versatile industrial applications: Optimized for mission-critical uses in manufacturing, healthcare, logistics, and smart cities, enhancing operational efficiency and intelligence.

●3.5 "Expanding the SBC Portfolio: ADLINK has announced the SBC35-MTL and SBC35-ASL, targeting both high-performance AI and robust embedded edge applications. ●AI Compatibility and Robust Design: The SBC35-MTL is equipped with an Intel Core Ultra featuring an NPU for real-time inference, while the SBC35-ASL is powered by the Intel Atom x7000RE, providing a wide temperature range and fanless operation. ●Flexible I/O with SBC-FM Modules: Both models support ADLINK's SBC-FM expansion modules, enabling customized I/O to accelerate deployment across various industries.

● High-Performance Computing: The EMP-520 series, equipped with the 14th generation Intel Core processor, delivers powerful processing capabilities, ensuring seamless multitasking and efficient management of heavy workloads. ● Excellent Visual Experience: With EDID emulation functionality, it supports simultaneous output of 4K video, providing vibrant and consistent displays ideal for dynamic digital signage environments. ● Reliable Design: The EMP-520 series is designed to withstand industrial environments, guaranteeing reliable operation 24/7, 365 days a year.

- Equipped with the Intel Core Ultra architecture featuring up to 14 CPU cores, 8 Xe GPU cores, and an integrated NPU for high-performance AI acceleration, offering both ultra power and energy efficiency. - 64GB of LPDDR5x memory is directly soldered onto the board, supporting maximum performance in a 95 x 70mm form factor, with an operating temperature range of -40°C to 85°C. - Integrated with up to 16 PCIe lanes, two SATA interfaces, two 2.5GbE Ethernet ports, and multiple DDI/USB4 and USB 3.0/2.0 interfaces for abundant I/O options.

●ADLINK has partnered with LIPS to announce an AMR 3D x AI solution using NVIDIA Isaac Perceptor. This solution is designed for autonomous mobile robots with enhanced 3D vision, a wide FOV, and high resolution, surpassing LiDAR. ●This solution includes the LIPSAMR Perception DevKit equipped with the DLAP-411-Orin and LIPSedge 3D camera, providing high-precision 3D recognition for smart manufacturing and warehouse logistics. ●The ADLINK DLAP-411-Orin platform and the LIPSAMR Perception DevKit equipped with NVIDIA Jetson AGX Orin deliver 275 TOPS of AI performance and support multi-camera synchronization for complex multi-vision applications.

The MXE-230, equipped with the Hailo-8 AI accelerator, can achieve 26 TOPS of edge AI computing capability. The low-power MXE-230, which integrates the Hailo-8 AI accelerator, is particularly suitable for scenarios that require AI processing capabilities while being sensitive to power consumption. Hailo is a global leading provider of high-performance accelerators specifically designed to run complex AI models on edge devices.

●Supports MediaTek Genio 510, achieving intensive workloads and low power consumption ●Offers up to 8GB LPDDR4 RAM, up to 128GB eMMC, 4K graphics support, 30MP ISP camera, and a rich variety of I/O options ●Operates in temperatures from 40℃ to 85℃, enduring long-term mission-critical use with a 10-year lifecycle ●Size-L module compliant with OSM R1.1

- Breakthrough in Generative AI Performance: The DLAP Supreme series equipped with Phison's aiDAPTIV+ technology overcomes memory limitations and performance bottlenecks of edge devices, achieving 8 times the inference speed and 4 times the token length, supporting the training of generative language models. - Core Value of aiDAPTIV+ Technology: Phison's aiDAPTIV+ technology plays a crucial role in efficiently running large language models on devices with different memory configurations, enabling expansion to more application scenarios. - Close Collaboration Driving Industry Progress: ADLINK and Phison have been collaborating for over 10 years. The release of the DLAP Supreme series further promotes the adoption of AI in smart manufacturing, smart cities, and other industries.

● ADLINK's NVIDIA Jetson Orin platform is compatible with NVIDIA JetPack 6.1, enhancing performance, security, and efficiency. ● The upgraded libraries and enhanced system services optimize AI visual analysis and generative AI application development. ● The ADLINK Edge AI platform, ideal for smart industries, offers unparalleled flexibility and robust computing power.

●Compact and Versatile: The EMP-100 is an industrial NUC (Next Unit of Computing) device equipped with dual 4K display capabilities, designed for space-saving use in both smart retail and industrial environments. ●Advanced Features: Powered by an Intel Celeron processor, it includes IoT connectivity, an M.2 expansion slot, and dual HDMI outputs, supporting digital signage, interactive kiosks, and AI/IoT applications. ●Industrial: Built to withstand harsh environments, it supports tasks such as real-time machine monitoring, IoT gateway functionality, and basic surveillance, making it ideal for automated production and edge computing.

● Supports 14th/13th/12th generation Intel Core i9/i7/i5/i3 and Intel N97 processors, enabling flexible performance options. ● High-speed capabilities with PCIe 5.0 x16, DDR5, and 2.5GbE PoE to accommodate high-performance applications. ● Versatile integration with abundant I/O options including RS-232/422/485, USB 3.2 Gen2, and M.2 slots.

● The EMP-100 industrial fanless mini PC (digital signage player) is suitable for various applications such as retail, restaurants, shopping complexes, and factories. It supports dual 4K displays and is equipped with multiple connectivity options and expansion interfaces. ● The fully waterproof stainless steel touch panel Titan2 is specially designed for applications in food processing, pharmaceuticals, chemicals, mining, and automation. It features an IP69K rated waterproof and dustproof case, meets stringent hygiene standards, and can withstand high-pressure hot water cleaning. ● ADLINK Technology is committed to integrating technological innovation with market needs, and by providing comprehensive industrial automation solutions globally, it is driving the acceleration of digital transformation across the industry.

● New ADLINK SBC35 Series: A compact 3.5-inch single-board computer designed for applications with space constraints. ● Robust processing options: Equipped with Intel N97 optimized for efficiency and high-performance 13th generation Intel Core i7/i5/i3/Celeron options. ● Wide connectivity and innovative expandability: Offers diverse native I/O capabilities and customizable SBC-FM function modules to enhance I/O expansion.

● The cost-effective ATX motherboard is optimized for your budget while providing essential performance and uncompromising reliability. ● It supports a wide range of Intel Core processors and accommodates diverse applications in various environments. ● It features robust connectivity with extensive I/O capabilities for industrial applications such as warehouse management, industrial automation, smart manufacturing, and new energy.

● Smart Manufacturing Product Series: The AI Edge Server MEC-AI7400 series is specially designed for smart manufacturing, promoting AI innovation in digital transformation and enhancing production flexibility and responsiveness. ● Diverse and Flexible Product Portfolio: Integrated with various ADLINK acceleration cards, featuring dustproof functionality and a compact chassis design, making it suitable for factory and automation environments. ● Total Solutions and Rapid Delivery: Providing comprehensive solutions with quick delivery times, ensuring reliable supply and high-quality products.

The compact 45mm x 45mm Open Standard Module (OSM) streamlines production with a modular system that has no overhead, providing 662 pins for miniaturization and enhancement of IoT applications. ADLINK is a pioneer of the OSM form factor, offering the OSM-IMX93 and OSM-IMX8MP, each equipped with the NXP i.MX 93 and NXP i.MX 8M Plus, respectively, demonstrating continuous breakthroughs in embedded computing.

ADLINK announces the AVA-7200, AVA-1000, and Passenger Information Display System (PIDS), leading railway technology. The AVA-7200 and AVA-1000 enhance the safety, efficiency, and connectivity of railway operations through advanced AI computing capabilities. The PIDS offers selectable display solutions using AUO's TARTAN display technology, addressing the diverse needs of the railway industry.

● Efficient Edge Device Management: ADLINK's EdgeGO provides an all-in-one software solution for the remote and secure management of edge devices across various industries. ● Improved Operational Efficiency: Real-time alerts, remote troubleshooting, and comprehensive device monitoring enable efficient and secure operations. ● Optimized for Various Fields: EdgeGO caters to sectors such as manufacturing, smart cities, healthcare, and retail, ensuring optimal performance and device management.

● Industrial ARM-based panel PC equipped with a high-performance NXP i.MX8M Plus processor, featuring a 32GB built-in multimedia card (eMMC) and an external Micro SD slot for storage expansion. ● Flexible configuration: modularity, speed, energy efficiency, excellent connectivity, long lifespan. ● Assisting system integrators, integrated solution providers, and brand vendors to quickly deliver cutting-edge features for individual HMI applications. ● Previewed at Embedded World 2024, recognized for design excellence, relative performance, and market impact, and awarded Best In Show.

The ASD+ Enterprise Series, designed for data-intensive applications such as data centers, AI-driven projects, and autonomous vehicle data loggers, guarantees top performance and unwavering reliability. These SSDs, available in 2.5-inch SATA, M.2 M Key, and U.2 PCIe form factors, feature PCIe Gen4 and 3D-TLC flash, offering a wide range of capacities with a 5-year warranty. With robust security measures including TCG-OPAL compliance, the ASD+ series protects sensitive data in enterprise environments.

ADLINK has announced the A380E, the first graphics card based on Intel GPU, featuring excellent performance and compatibility with the ADLINK gaming platform. The A380E not only demonstrates its capabilities in commercial gaming but also extends its usefulness to edge AI applications by leveraging the powerful support of the OpenVino AI toolkit. This integration allows the A380E to streamline AI development and seamlessly incorporate deep learning capabilities.

●ADLINK announces two new modules, COM Express and SMARC, equipped with the latest Intel Atom processors. ●With soldered memory and extreme temperature options, this module can meet various high-performance, low-power, and robust edge solutions that operate 24/7. ●Supporting Intel TCC and Time Sensitive Networking (TSN), this module is suitable for hard real-time computing workloads required in use cases such as industrial automation, AI robotics, smart retail, transportation, and network communications.

ADLINK adds support for the 14th generation Intel Core processors to its main product line, enhancing the performance and AI capabilities of diverse computing systems. This upgrade includes the IMB-M47, IMB-M47H motherboards, and NuPRO-E47 SBC, with the MVP-5200/MVP-6200 series scheduled for release in late 2024. The upgrade to the 14th generation processors demonstrates ADLINK's commitment to innovation in edge computing and AI, providing customers with advanced and future-proof technology.

ADLINK will launch the Titan2 series of industrial panel PCs made of stainless steel, compliant with IP69K, designed for harsh industrial environments. With a corrosion-resistant chassis, 11th generation Intel Core processors, and M12 connectors, it achieves stability, hygiene, and seamless IIoT integration. With customizable options and powerful computing, the Titan2 is ideal for food processing, pharmaceuticals, and automotive production.

● IIoT gateway equipped with the high-performance, low-power NXP i.MX 8M Plus processor ● Robust, fanless, wireless-enabled, 5G compatible ● Ideal for smart manufacturing, renewable energy, and smart cities

The COM Express module "cExpress-MTL" equipped with Intel Core Ultra integrates up to 8 Xe cores (128 EUs), an NPU, and 14 CPU cores (6P+8E), providing 1.9 times the GPU performance of the previous generation with a TDP of 28W, along with dedicated AI acceleration that reduces power consumption. By utilizing Intel's modular architecture's low-power E cores, Intel Core Ultra achieves 30-50% higher power efficiency compared to the 13th generation Intel Core processors. ADLINK's cExpress-MTL module effectively simplifies the design of solutions requiring graphics and AI for applications such as portable medical ultrasound devices, industrial automation, autonomous driving, and AI robotics, leveraging graphics and AI capabilities without the need to connect to external components, along with hardware-accelerated AV1 encoding/decoding.