IPC System DLAP-3000-CF Series
Supports MXM graphics modules with 8th/9th generation Intel Core i7/i5/i3 on LGA1151 socket.
ADLINK provides an optimized high-availability computing platform with scalability options, including MXM cards. The DLAP-3000-CFL series platform features active cooling for applications that require a very high level of computing in limited space, supporting performance-demanding workloads such as deep learning. Features of the DLAP-3000-CFL series: - Minimal embedded GPU platform (3 liters) - Reliable low TDP MXM GPU design - Scalable graphics processing from Pascal to Turing GPUs.
basic information
Embedded system supporting MXM graphic modules with 8th/9th generation Intel Core i7/i5/i3 on LGA1151 socket 【Features】 - Support for ADLINK MXM graphic modules (Type A/B, up to 120W) - 8th/9th generation Intel Core i7/i5/i3, Celeron processors - Dual SODIMM for up to 64 GB of DDR4 non-ECC memory (dependent on CPU) - DisplayPort (2 from CPU, 4 from MXM) - M.2 E-key x1 supporting 1630 or 2230 for Wi-Fi/Bluetooth module, M.2 B-key x1 supporting 2242 or 2280 for SATA storage module - Reliable Molex-type 12V DC input connector
Price information
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Delivery Time
Model number/Brand name
DLAP-3000-CF Series
Applications/Examples of results
- Smart Manufacturing - Smart City - Intelligent Transportation - Security Monitoring - Medical
