IPC System DLAP-3200-CF Series
Embedded system compatible with MXM modules featuring 8th/9th generation Intel Core i7/i5/i3 on LGA1151 socket.
ADLINK provides an optimized high-availability computing platform with scalability options, including MXM cards. The DLAP-3200-CF series platform features active cooling for applications that require a very high level of computing in limited space, supporting performance-demanding workloads such as deep learning.
basic information
Embedded system compatible with MXM modules featuring 8th/9th generation Intel Core i7/i5/i3 processors on LGA1151 socket 【Features】 - Support for ADLINK's MXM graphic modules (Type A/B, up to 120W) - 8th/9th generation Intel Core i7/i5/i3, Celeron processors - Dual SODIMM for up to 64 GB of DDR4 non-ECC memory (dependent on CPU) - DisplayPort (2 from CPU, 4 from MXM) - One M.2 E-key supports Wi-Fi/Bluetooth module 1630 or 2230, and one M.2 B-key supports SATA storage module 2242 or 2280 - Reliable Molex type 12V DC input connector - One Intel i219-LM and three Intel i210-AT - Two PCIe Gen3 x4 expansion slots for full-height half-length add-on cards. Each slot has a 25W power budget and supports additional Molex 4-pin power cable (12V/1.5A and 5V/2A)
Price information
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Delivery Time
Model number/Brand name
DLAP-3200-CF Series
Applications/Examples of results
- Smart Manufacturing - Smart City - Intelligent Transportation - Security Monitoring - Medical
