Ultrasonic High-Precision Flip Chip Bonder FA2000SS
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Ultrasonic flip chip bonder capable of high-precision implementation with ultrasonic processes.
The FA700 ultrasonic high-precision flip chip bonder enables the development of advanced semiconductor packaging technologies, such as three-dimensional semiconductors, through the ultrasonic bonding process. It allows for high-precision alignment with an IR transmission optical system and is equipped with high-precision positioning functions, including infrared optical systems. 【Features】 ○ High-precision positioning function ○ High-quality bonding ○ Detailed bonding condition settings For more information, please contact us or download the catalog.
basic information
【Features】 ○ Development of advanced semiconductor packaging technology such as three-dimensional semiconductors using ultrasonic joining processes ○ High-precision alignment possible with IR transmission optical systems → Achieves alignment of X: ±1μm, Y: ±1μm ○ Equipped with high-precision positioning functions such as infrared optical systems → Simultaneous top and bottom field of view optical system (standard): Alignment accuracy of 5μm → IR optical system (optional): Alignment accuracy of ±1μm ○ Linear control of load in accordance with the increase in bonding area → Controls bonding by spreading from the bonding starting point at the center of the bump ○ Bonding control functions that respond to detailed condition settings during research and development → Monitoring software for bonding profiles is also standard equipment ● For more details, please contact us or download the catalog.
Price information
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Delivery Time
Applications/Examples of results
【Application】 ○ Development of advanced semiconductor packaging technology such as three-dimensional semiconductors using ultrasonic bonding processes. ● For more details, please contact us or download the catalog.
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News about this product（2）
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Notice of Participation in "JPCA Show 2025" from June 4 (Wednesday) to June 6 (Friday), 2025.
Adwells Co., Ltd. will be exhibiting at the "JPCA Show 2025 (Total Solution Exhibition for Electronic Devices)" held at Tokyo Big Sight. At the exhibition, we will introduce ultrasonic application technologies such as heat sink formation, power module bonding, DMB bonding, flexible substrate bonding, and ultrasonic cutting. Additionally, we plan to display a variety of samples processed with our equipment from various fields, which we believe will be helpful in realizing new ideas and solving challenges. We invite you to visit our booth when you attend the event.
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"May 14 (Wednesday) to May 16 (Friday), 2025" Announcement of participation in the "9th Adhesive and Joining EXPO (Osaka)" (Hall 4, Booth No. 18-78)
Adwells Co., Ltd. will be exhibiting at the "9th Adhesive and Joining EXPO (Osaka)" held at Intex Osaka (Hall 4, Booth No. 18-78). Our company is a manufacturer of ultrasonic application devices with unique ultrasonic technology. We will propose devices that apply ultrasonic technology for joining, cutting, and welding, and we plan to introduce joining/welding technology and cutting technology as ultrasonic application technologies at the exhibition. Additionally, we will showcase a variety of samples processed with our devices from various fields, which we believe will be helpful in realizing new ideas and solving challenges. Exhibits: - Heat sink formation using pins/ribbons/block fins - Power module joining (terminal joining, terminal joining without patterns or with minimal patterns, inter-board joining) - DMB joining (harness joining on organic substrates, discrete devices, large area joining) - Flexible substrate joining (short-time joining, room temperature joining, low connection joining) - Ultrasonic cutting (cutting of soft multilayer materials, cutting of green sheets, slicing of TIM, cutting of active material coated electrodes) We sincerely look forward to your visit.
