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[Device Category] Ultrasonic Welding Device
![[Device Category] Ultrasonic Welding Device](https://image.mono.ipros.com/public/premium/image_category/a8a/1430943/IPROS64786709892895228434.png?w=140&h=140)
[Device Category] Ultrasonic Welding Device
Equipped with precision control technology for the joining process that achieves stable bonding.
1～11 item / All 11 items
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Ultrasonic High-Precision Flip Chip Bonder FA2000SS
Ultrasonic flip chip bonder capable of high-precision implementation with ultrasonic processes.
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Ultrasonic Seam Welding Machine SB200/400CE
Ultrasonic seam welding machine that transforms manufacturing with rotary ultrasonic welding.
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Mass production ultrasonic metal joining device TB1000MS
This is a mass production ultrasonic metal joining device suitable for inverter production!
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Ultrasonic Metal Joining Device UP-Lite1500
Compatible with a wide range of applications! A multifunctional ultrasonic welding system integrated in a compact design.
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Standalone Ultrasonic Metal Welding Machine UB050/300/500SA
Compact and easy to deploy in production and development sites! Equipped with comprehensive process monitoring features.
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Standalone Ultrasonic Welding Machine UB2000/3000/5000SA
In addition to joining the same type of metal, welding enables the joining of different types of metals that is difficult to achieve!
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Ultrasonic Metal Joining Device UB2000/3000/5000LS
Ideal for power devices! The ultrasonic head is highly rigid and compact!
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Introducing the latest applications of next-generation secondary batteries!
From research and development of next-generation secondary batteries to mass production. Providing ultrasonic joining devices/ultrasonic cutters!
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Introducing the latest applications for power devices!
From R&D for power devices to mass production. Providing ultrasonic bonding equipment!
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Ultrasonic High-Precision Flip Chip Bonder 'FA2000'
Development of advanced semiconductor packaging technology such as three-dimensional semiconductors using ultrasonic bonding processes.
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Flip Chip Bonder "FB2000SS"
Supports various processes with head exchange! Achieves a wide dynamic range through a low-friction pressurization mechanism.
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