Standalone Ultrasonic Metal Welding Machine UB050/300/500SA
![[Device Category] Ultrasonic Welding Device](https://image.mono.ipros.com/public/premium/image_category/a8a/1430943/IPROS64786709892895228434.png?w=140&h=140){kind=small}
![[Device Category] Ultrasonic Cutter](https://image.mono.ipros.com/public/premium/image_category/a8a/1430943/IPROS09531302303078425129.png?w=140&h=140){kind=small}
![[Device Category] Ultrasonic Welding Device](https://image.mono.ipros.com/public/premium/image_category/a8a/1430943/IPROS18280580037540925390.png?w=140&h=140){kind=small}
Compact and easy to deploy in production and development sites! Equipped with comprehensive process monitoring features.
The standalone ultrasonic metal joining device 'UB050/300/500SA' is a compact standalone ultrasonic metal joining device that is easy to place in production and development sites. With a built-in linear encoder and rigid clamp in the joining head, it accurately controls the position of the joint using a high-rigidity ultrasonic horn unit. Additionally, it achieves a wide dynamic range through a low-friction pressurization mechanism, providing high responsiveness to deformation during joining, and improves joinability by increasing the load with linear pressurization as the joining progresses. 【Features】 ■ High-rigidity horn clamp mechanism ■ High-precision position control ■ High-functionality load control ■ Comprehensive process monitoring capabilities *For more details, please refer to the PDF materials or feel free to contact us.
basic information
【Specifications】 ■ Head Load: Load 10–500N ■ Head Type: Ultrasonic Head ■ Ultrasonic Frequency: Frequency 30kHz/40kHz (350/750W), 50kHz (250W) ■ Head Control: Digital control of load and ultrasound ■ Joining Monitoring: Standard profile reference software included ■ Recipe: Digital setting of joining conditions ■ Utilities ・ Air Source: 0.5MPa Dry Air ・ Power Supply: Main unit 100V10A, Oscillator 30kHz/40kHz: 100V5.2A/10A, 50kHz: 100V2.5A ■ Unit Size: W400 x D860 x H606mm (main unit) ■ Unit Weight: 150kg *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Applications】 ■ Joining of similar and dissimilar metals ■ Bulk joining of metal foils for secondary batteries ■ Joining of wire harnesses and connectors *For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
News about this product（2）
-
Notice of Participation in "JPCA Show 2025" from June 4 (Wednesday) to June 6 (Friday), 2025.
Adwells Co., Ltd. will be exhibiting at the "JPCA Show 2025 (Total Solution Exhibition for Electronic Devices)" held at Tokyo Big Sight. At the exhibition, we will introduce ultrasonic application technologies such as heat sink formation, power module bonding, DMB bonding, flexible substrate bonding, and ultrasonic cutting. Additionally, we plan to display a variety of samples processed with our equipment from various fields, which we believe will be helpful in realizing new ideas and solving challenges. We invite you to visit our booth when you attend the event.
-
"May 14 (Wednesday) to May 16 (Friday), 2025" Announcement of participation in the "9th Adhesive and Joining EXPO (Osaka)" (Hall 4, Booth No. 18-78)
Adwells Co., Ltd. will be exhibiting at the "9th Adhesive and Joining EXPO (Osaka)" held at Intex Osaka (Hall 4, Booth No. 18-78). Our company is a manufacturer of ultrasonic application devices with unique ultrasonic technology. We will propose devices that apply ultrasonic technology for joining, cutting, and welding, and we plan to introduce joining/welding technology and cutting technology as ultrasonic application technologies at the exhibition. Additionally, we will showcase a variety of samples processed with our devices from various fields, which we believe will be helpful in realizing new ideas and solving challenges. Exhibits: - Heat sink formation using pins/ribbons/block fins - Power module joining (terminal joining, terminal joining without patterns or with minimal patterns, inter-board joining) - DMB joining (harness joining on organic substrates, discrete devices, large area joining) - Flexible substrate joining (short-time joining, room temperature joining, low connection joining) - Ultrasonic cutting (cutting of soft multilayer materials, cutting of green sheets, slicing of TIM, cutting of active material coated electrodes) We sincerely look forward to your visit.
