Ultrasonic Applications in the Semiconductor Electronic Components Industry

Ultrasonic Applications in the Semiconductor Electronic Components Industry
We provide ultrasonic application devices that respond to changes in materials and manufacturing processes due to performance improvements in semiconductors and electronic components.
1~9 item / All 9 items
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Standalone Ultrasonic Metal Welding Machine UB050/300/500SA
Compact and easy to deploy in production and development sites! Equipped with comprehensive process monitoring features.
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Standalone Ultrasonic Welding Machine UB2000/3000/5000SA
In addition to joining the same type of metal, welding enables the joining of different types of metals that is difficult to achieve!
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Ultrasonic Metal Joining Device UB2000/3000/5000LS
Ideal for power devices! The ultrasonic head is highly rigid and compact!
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Ultrasonic Seam Welding Machine SB200/400CE
Ultrasonic seam welding machine that transforms manufacturing with rotary ultrasonic welding.
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Flip Chip Bonder "FB2000SS"
Supports various processes with head exchange! Achieves a wide dynamic range through a low-friction pressurization mechanism.
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Ultrasonic Metal Joining Device UP-Lite1500
Compatible with a wide range of applications! A multifunctional ultrasonic welding system integrated in a compact design.
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Ultrasonic Ribbon Bond RB0300SS
Power module and secondary battery circuit formation! Digital control of position, load, and ultrasound.
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Ultrasonic Cutter UC1000LS
Ultrasonic cutter for cutting metal and resin materials with high-quality cross-sections.
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Standalone Ultrasonic Cutter 'UC1000SA' <High-Quality Cross Section>
Widely usable from R&D to mass production automatic machine integration! Cutting metal foil with high-quality cross-sections.
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