Ultrasonic Metal Joining Device UP-Lite1500
Compatible with a wide range of applications! A multifunctional ultrasonic welding system integrated in a compact design.
The "UP-Lite1500" is a metal joining device suitable for transitioning from power device development to mass production. This machine is designed as a standalone unit with the premise of being integrated into a mass production system. Development recipes can be directly transitioned to mass production. By adopting a unique rigid clamp method for holding the horn, it achieves high rigidity while maintaining a highly flexible cantilever structure. 【Features】 ■ Suitable for standalone and device integration ■ High rigidity with a highly flexible cantilever structure ■ Integrated joining system with monitoring capabilities ■ Compatible with a wide range of applications *For more details, please refer to the PDF materials or feel free to contact us.
basic information
【Specifications】 ■Bonding force: Load 1500N ■Head availability: Ultrasonic head ■Ultrasonic head: Choose from frequencies 20, 30kHz ■Ultrasonic output: Choose from 20kHz/3000, 1250W, 30kHz/1250W ■Head control: Digital control of load and ultrasound ■Bonding monitor: Standard profile reference software included ■Utility: Air pressure 0.5MPa Dry air Power supply Main unit / Single phase 85–264V 3A Oscillator / Three phase 200V 20A (at 3600W) ■Unit size: W193×D432×H282mm (main unit) ■Unit weight: 25kg (main unit) *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
News about this product(2)
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Notice of Participation in "JPCA Show 2025" from June 4 (Wednesday) to June 6 (Friday), 2025.
Adwells Co., Ltd. will be exhibiting at the "JPCA Show 2025 (Total Solution Exhibition for Electronic Devices)" held at Tokyo Big Sight. At the exhibition, we will introduce ultrasonic application technologies such as heat sink formation, power module bonding, DMB bonding, flexible substrate bonding, and ultrasonic cutting. Additionally, we plan to display a variety of samples processed with our equipment from various fields, which we believe will be helpful in realizing new ideas and solving challenges. We invite you to visit our booth when you attend the event.
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"May 14 (Wednesday) to May 16 (Friday), 2025" Announcement of participation in the "9th Adhesive and Joining EXPO (Osaka)" (Hall 4, Booth No. 18-78)
Adwells Co., Ltd. will be exhibiting at the "9th Adhesive and Joining EXPO (Osaka)" held at Intex Osaka (Hall 4, Booth No. 18-78). Our company is a manufacturer of ultrasonic application devices with unique ultrasonic technology. We will propose devices that apply ultrasonic technology for joining, cutting, and welding, and we plan to introduce joining/welding technology and cutting technology as ultrasonic application technologies at the exhibition. Additionally, we will showcase a variety of samples processed with our devices from various fields, which we believe will be helpful in realizing new ideas and solving challenges. Exhibits: - Heat sink formation using pins/ribbons/block fins - Power module joining (terminal joining, terminal joining without patterns or with minimal patterns, inter-board joining) - DMB joining (harness joining on organic substrates, discrete devices, large area joining) - Flexible substrate joining (short-time joining, room temperature joining, low connection joining) - Ultrasonic cutting (cutting of soft multilayer materials, cutting of green sheets, slicing of TIM, cutting of active material coated electrodes) We sincerely look forward to your visit.